2017 56th Annual Conference of the Society of Instrument and Control Engineers of Japan (SICE) 2017
DOI: 10.23919/sice.2017.8105751
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Investigation of effects of silica particles on light extraction efficiency of light-emitting diode packaging using ray-tracing simulation

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“…The performance of the white LED PKG is principally determined by the structure [8,9] and optical properties of the PKG components, namely, PKG resin (injection moulding resin), a lead frame (L/F) [10,11], die-bonding paste [12,13], bonding wire [14][15][16], mould resin (silicone or epoxy resin) [17][18][19] containing a phosphor [20][21][22][23][24][25], and diffuser materials [26]. Performance of each PKG component has been improved in development of each area.…”
Section: Introductionmentioning
confidence: 99%
“…The performance of the white LED PKG is principally determined by the structure [8,9] and optical properties of the PKG components, namely, PKG resin (injection moulding resin), a lead frame (L/F) [10,11], die-bonding paste [12,13], bonding wire [14][15][16], mould resin (silicone or epoxy resin) [17][18][19] containing a phosphor [20][21][22][23][24][25], and diffuser materials [26]. Performance of each PKG component has been improved in development of each area.…”
Section: Introductionmentioning
confidence: 99%