Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module

Chen, Yiyi; Li, Bo; Wang, Xin; Yan, Yuying; Wang, Yangang; Fang, Qi

doi:10.1016/j.tsep.2019.01.007

Cited by 49 publications

(16 citation statements)

References 19 publications

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“…If it is necessary, in perspective modifications of LED luminaires for special purposes, one can use LED sources with the power higher than 500 W. In this case, it is purposeful to choose larger amount of heat pipes and rings. Besides, to disperse the high thermal flux over the whole surface of carrying base, it is reasonable to use heat-distributing spacers between COB matrix and carrying base in the form of thin vapor chambers [47][48][49] that also operate using the closed evaporationcondensation cycle for heat transmitting.…”

Section: Recommendations For Practical Application Of the Developed Lmentioning

confidence: 99%

Optimization of the cooling system design for a compact high-power LED luminaire

Pekur¹,

Nikolaenko²,

Сорокин³

2020

Semicond. phys. quantum electron. and optoelectron.

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Using the method of computer modelling, considered in this paper is optimization of a passive air system design for cooling the powerful LED luminaire based on heat pipes and cooling rings. Thermal and mass characteristics of the cooling system have been studied for various design parameters: distance between rings, thickness of ring materials and thermal loads. It has been shown that, to provide a minimal case temperature of LED source, the optimal distance between cooling rings should be 6 mm, but in this case the mass of cooling system is not least. To reduce the luminaire mass, it is reasonable to choose the distance between the cooling rings equal to 8 mm. Then the temperature of light source increases by only 1.8 °С, or by 2.2%, while the mass of cooling system reduces by 1357 g, or by 20.5%. At the same time, lowering the ring thickness from 2 down to 0.8 mm can in addition reduce this mass by 2700 g, or by 48.6%. However, when doing so the temperature of LED source case is increased by 5.9 °С. The offered cooling system based on heat pipes is capable to provide the thermal resistance 0.131 °С/W when scattering the thermal power 500 W under the maximum temperature of LED source crystal 135.5 °С. Recommendations for application of the developed cooling system have been formulated.

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Section: Recommendations For Practical Application Of the Developed Lmentioning

confidence: 99%

Optimization of the cooling system design for a compact high-power LED luminaire

Pekur¹,

Nikolaenko²,

Сорокин³

2020

Semicond. phys. quantum electron. and optoelectron.

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“…There are no moving parts in the design of heat pipes, which significantly prolongs their service life, as long as there is no mechanical damage. When using more powerful advanced LED arrays with critically high local heat flux densities in the design of the luminaire, it is possible to use ceramic [20], metal [21] or silicon [22] vapor chambers as heat-transfer gaskets placed between the COB matrix and the supporting base. Being another two-phase heat transfer device based on the closed vaporization-condensation cycle of operation liquid, vapor chamber effectively disperses high local heat flux to a larger surface of the supporting base.…”

Section: Recommendations For Using the Proposed Highpower Led Luminairementioning

confidence: 99%

“…In recent years, the problem of efficient cooling of LEDs and high-power LED matrices was addressed by using two-phase heat transfer devices, i.e. thermosyphons [15], heat pipes [16][17][18][19] and vapor chambers [20][21][22]. There were also some developments of two-phase cooling systems for LEDs that involved immersing LEDs in a low-boiling liquid [23].…”

Section: Introductionmentioning

confidence: 99%

Electro-optical characteristics of an innovative LED luminaire with an LED matrix cooling system based on heat pipes

Pekur¹,

Сорокин²,

Nikolaenko³

et al. 2020

SPQEO

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Widespread use of energy-saving LED lighting systems powered by renewable energy sources, solar energy in particular, will contribute to the improvement of global ecology. One of the structural elements of such lighting systems is LED luminaire. The authors of this article perform a first ever experimental study of electro-optical characteristics of the basic version of a compact high-power LED luminaire for indoor use. The particular feature of this lighting device is that its cooling system for the LED light source is based on heat pipes and concentric cooling rings. Such design allows ensuring the required cooling efficiency of the LED matrix. The revealed trends in optical and electrical parameters during temperature stabilization indicate that the proposed cooling system is highly efficient in maintaining normal thermal conditions of LED light sources with a power of up to 140.7 W and a luminous flux of up to 15083 lm. The results on determining spatial distribution of luminous flux of these luminaires indicate that they may be used for lighting large rooms with high ceilings. Scaling the basic modular design version of the cooling system allows increasing the power of the LED light source up to 600 W.

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“…Sn-3.5Ag solder is easily damaged in IGBT module due to its low melting temperature and yield stress and high thermal expansion coefficient. Figure 8 shows the thermal displacement and deformation shape of Sn-3.5Ag solder layer [19]. Three solder layers bend into a convex shape because of tensile stress and that the upper surfaces displace more than the bottom surfaces.…”

Section: Thermo-mechanical Performancementioning

confidence: 99%

Thermal Analyses of Power Electronics Integrated with Vapour Chamber Cooling

Chen

Yan

2020

Automot. Innov.

Self Cite

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Insulated gate bipolar transistor (IGBT) power module is used for power switching transistor devices in the power supply and motor control circuits in both hybrid electric vehicles and electric vehicles. The target of heat flux of IGBT is continuously increasing due to the demand for power rating improvements and miniaturisation. Without suitable efficient cooling technologies, excessively high temperature and uneven temperature distribution can cause high thermal stress, eventually leading to severe module failures. Therefore, highly efficient cooling solutions are highly required. Vapour chamber with phase change can provide quick heat transfer and low temperature gradient. This study proposes a new IGBT structure integrated with vapour chamber. The tests and simulation results indicate that the thermal and thermo-mechanical performances of IGBT integrated with vapour chamber are better than those of the IGBT with copper baseplate module. The thermal resistance between the junction and heat sink is reduced from 0.25 to 0.14 °C/W, and the temperature uniformity is greatly improved due to the phase change in the vapour chamber. The simulation also investigates the thermal stress distribution, deformation and thermal fatigue lifespan of IGBT power electronics module. A reduction of 21.8% in thermal stress and an increase of 9% in lifespan of Sn–3.5Ag solder are achieved.

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Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module

Cited by 49 publications

References 19 publications

Optimization of the cooling system design for a compact high-power LED luminaire

Optimization of the cooling system design for a compact high-power LED luminaire

Electro-optical characteristics of an innovative LED luminaire with an LED matrix cooling system based on heat pipes

Thermal Analyses of Power Electronics Integrated with Vapour Chamber Cooling

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