Investigation of Metal Co-evaporated Copper Seed Layers for Copper-Plated Heterojunction Solar Cells

Direct Electroplating on Indium-Tin-Oxide-Coated Textured and Polished Silicon Substrates via Transition Metal Alloyed Interlayers

“…Initially evaporated Cu seed layers with subsequent electroplating were also shown to have good adhesion. [4][5][6] However, the metal evaporation technique needs a high vacuum chamber and does not provide high-throughput.…”