“…It is reported that up-to-date RMS roughness for device-ready GaN films is about 1.1 nm, which is achieved in the three most popular substrate cases, sapphire, SiC, and Si substrates, using conventional high-temperature growth techniques such as MOCVD, HVPE (hydride vapour phase epitaxy) or MBE. [26][27][28][29][30][31][32][33] Clearly, the up-to-date RMS roughness value is similar to that of the GaN films grown on nitrided LiGaO 2 substrates in this work. Apparently, the GaN film on the nitrided LiGaO 2 substrate shows a very smooth and device-ready surface.…”