Investigation of return loss of 15 bonding wires fabricated on a test board by FDTD method

Abstract

Return losses of 1~15 bonding wires fabricated on a test board for RF and microwave circuit applications are studied by the finite-difference time-domain (FDTD) method. In order to fit a cell size of 0.25 mm, an equivalent material obtained by the effective material property technique is applied to model bonding wires, the top metallic patch, and the bottom metallic layer. Simulation results of return losses obtained by the FDTD method are presented and compared with those obtained by the HFSS software at frequencies of 0.04~6 GHz. It is found that simulation results calculated by the FDTD method make a good agreement with those obtained by the HFSS software. It is also found that the return loss of bonding wires can be improved by using multiple wires placed in parallel in bonding wire arrays.

A Review of Metamaterials and its Applications

“…The modeling of metamaterials is much important with this method and is also very difficult task. TLM model permits the design of different structures based on conducting thin-wires [44][45].…”

A Structure Optimization Approach to Improve the Transmission Performance of Bonding Wire

“…In previous studies, bonding wires were modeled and characterized as parasitic effects, due to their geometrical long lengths, wire spacing, small diameters, and ground capacitances [4]. The parasitic effects are comprised of series resistance with variation due to skin effect, self-inductance and mutual-inductance of the bonding wires, and shunt capacitance from die pads and the integrated circuit model [5], [6], [7].…”