Investigation of roughness evolution of ion sputtered fused silica surface

Ji, Jianwei; Fan, Wei; Gao, Wei; Wang, Chao; Zhang, Yunfei; Xu, Min; Ji, Fang

doi:10.1364/ao.58.005388

Cited by 7 publications

(2 citation statements)

References 34 publications

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“…The details about the repeated positioning method and the analysis of positioning accuracy can be found in Ref. 22. A scanning electron microscope (SEM, Hitachi TM4000Plus) was used to investigate the surface morphology.…”

Section: Experimental Methodsmentioning

confidence: 99%

Electrochemical Polishing of Tungsten: An Investigation of Critical Spatial Frequency and Ultimate Roughness

Ji¹,

Khan²,

Zhan³

et al. 2022

J. Electrochem. Soc.

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Electrochemical polishing (ECP) offers incomparable advantages and great potential in metal polishing by correction of surface errors. This paper systematically investigates the ultimate roughness and correction of surface errors capability of ECP over different spatial frequency ranges and further explores the law of ECP influencing errors at different frequency ranges, proposes and clarifies the concept of critical spatial frequency, and studies the law of polishing parameters affecting critical spatial frequency by using spatial frequency spectrum analysis. The surface roughness evolution and ultimate roughness of ECP were investigated using the surface error filtering method based on the critical spatial frequency. The ultimate roughness of ECP was determined by two different strategies, (i) stepwise polishing and (ii) one-step polishing. In addition, the stepwise polishing was also investigated for any possible inconsistency with one-step polishing on the final surface roughness. As ECP progressed, the optimization speed of surface roughness gradually decreased, and the surface roughness eventually reached a stable limiting value. Further analysis revealed that crystal corrosion is mainly responsible for inhibiting surface roughness optimization.

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Section: Experimental Methodsmentioning

confidence: 99%

Electrochemical Polishing of Tungsten: An Investigation of Critical Spatial Frequency and Ultimate Roughness

Ji¹,

Khan²,

Zhan³

et al. 2022

J. Electrochem. Soc.

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show abstract

“…The details about the repeated positioning method and the analysis of positioning accuracy can be found in Ref. [15]. The surface quality before and after ECP is shown in Fig.…”

Section: Ecp Of Tungstenmentioning

confidence: 99%

A Study on Universal Factor Determining the Evolution of Surface Roughness During Electrochemical Polishing

Ajmal²,

Zhan³

et al. 2021

Preprint

Self Cite

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Electrochemical polishing (ECP) is widely used for scratch- and damage-free finishing of metal components. Though the polishing effect of ECP has been confirmed in many researches, the influence of polishing parameters on evolution of surface roughness is still ambiguous owing to the use of different ECP systems. In this paper, the universal factor determining the evolution of surface roughness during ECP is studied by theoretical analysis as well as experiments. Theoretical analysis based on viscous layer mechanism demonstrates that the material removal thickness is the key parameter governing the roughness evolution of the polished surface regardless of other parameters including the voltage, current and electrolyte concentration and so forth. A series of experiments were designed and carried out to verify the proposed hypothesis. Both the experimental results and already published researches proved the validity and universality of the newly developed hypothesis on surface roughness evolution. This work is of great significance for further understanding the finishing mechanism of ECP and process control for its practical applications.

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Material removal thickness: a universal factor determining the evolution of surface roughness in electrochemical polishing

Khan

Zhan

et al. 2022

Int J Adv Manuf Technol

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Investigation of roughness evolution of ion sputtered fused silica surface

Cited by 7 publications

References 34 publications

Electrochemical Polishing of Tungsten: An Investigation of Critical Spatial Frequency and Ultimate Roughness

Electrochemical Polishing of Tungsten: An Investigation of Critical Spatial Frequency and Ultimate Roughness

A Study on Universal Factor Determining the Evolution of Surface Roughness During Electrochemical Polishing

Material removal thickness: a universal factor determining the evolution of surface roughness in electrochemical polishing

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