Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

Kim, Yeonsung; Liu, Dapeng; Lee, Hohyung; Liu, Ruiyang; Sengupta, Dipak L.; Park, Seungbae

doi:10.1109/tcpmt.2015.2442751

Cited by 27 publications

(14 citation statements)

References 22 publications

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“…By the process simulation, it has been shown that most of the thermal stress on the sensor chip is generated during the cooling process, and the stress during curing process can be neglected for its relative low modulus. According to the results reported by Kim et al [42,71], the modulus, CTE and glass transition temperature T g are the key parameters for compound material selection. Materials with low modulus, low CTE and low T g can be the candidates to limit the thermal stress on sensor chip.…”

Section: Inducements To Thermal-performance Instabilitymentioning

confidence: 99%

“…Firstly, the resistance of piezoresistors and piezoresistive coefficient will vary with the temperature, which will influence the zero-offset and sensitivity of the device [38]. Then, as a stress-based transduction device, the residual stresses from the chip fabrication process [39,40], wafer bonding [41], adhesion and compound molding [42,43] can lead to obvious variations in sensor parameters. Meantime, the difference of coefficient of thermal expansion (CTE) between the materials will induce a significant accompanying stress in the device, and the effect varies under different ambient temperatures for different sensors [44,45,46].…”

Section: Introductionmentioning

confidence: 99%

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Thermal-Performance Instability in Piezoresistive Sensors: Inducement and Improvement

Liu

Wang

Zhao

et al. 2016

Sensors

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The field of piezoresistive sensors has been undergoing a significant revolution in terms of design methodology, material technology and micromachining process. However, the temperature dependence of sensor characteristics remains a hurdle to cross. This review focuses on the issues in thermal-performance instability of piezoresistive sensors. Based on the operation fundamental, inducements to the instability are investigated in detail and correspondingly available ameliorative methods are presented. Pros and cons of each improvement approach are also summarized. Though several schemes have been proposed and put into reality with favorable achievements, the schemes featuring simple implementation and excellent compatibility with existing techniques are still emergently demanded to construct a piezoresistive sensor with excellent comprehensive performance.

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Section: Inducements To Thermal-performance Instabilitymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Thermal-Performance Instability in Piezoresistive Sensors: Inducement and Improvement

Liu

Wang

Zhao

et al. 2016

Sensors

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“…He used the experimental data for numerical simulation, and estimated the temperature and humidity stress of MEMS sensor device under temperature cycle. Although his research is more accurate, but the lack of necessary experimental data [2]. Park DH studied the influence of the MEMS airbag sensor package module on the signal.…”

Section: Introductionmentioning

confidence: 99%

Simulation of Gymnastics Performance Based on MEMS Sensor

Chen

Kuang

2021

Preprint

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The development and progress of multi-sensor data fusion theory and method also lay the foundation for the research of human posture tracking system based on inertial sensor. This paper mainly studies the simulation of gymnastic performance based on MEMS sensors. In the preprocessing of reducing noise interference, this paper mainly uses median filter to remove signal burr. In this paper, the use of virtual character model for gymnastics performance. The computer receives sensor data from the sink node of the motion capture device through a Bluetooth communication module. The unit calculates the quaternion output from the dynamic link library of sensor data processing, calculates the rotation and coordinate offset of the limb where each sensor node is located, and realizes the real-time rendering of the virtual human model by using the driver of the human model. At the same time, it controls the storage of sensor data, the driving of model and the display of graphical interface. When the gesture action is about to happen, a trigger signal is given to the system to mark the beginning of the action, so as to obtain the initial data of each axis signal of MEMS sensor. When the gesture action is completed, a signal to end the action is given to the system to mark the end of the action, so that the original signal data between the beginning and end of the gesture action can be captured. In order to ensure the normal communication between PS and PL, it is necessary to test the key interface. Because the data received by the SPI acquisition module is irregular, it is unable to verify whether the data is wrong. Therefore, the SPI acquisition module is replaced with an automatic incremental data module, and it is generated into an IP core to build a test platform for testing. The data show that the average measurement errors of x-axis displacement, Y-axis displacement, z-axis displacement and three-dimensional displacement are 8.17%, 7.51%, 9.72% and 8.7%, respectively. The results show that the MEMS sensor can accurately identify the action with high accuracy.

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“…In the past, a lot of research was also carried out to understand the impact of hygro-thermo-mechanical stresses induced in MEMS sensor device packages [17][18][19][20][21][22]…”

Section: Introductionmentioning

confidence: 99%

Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials

Kumari¹,

Singh²,

Singal³

2020

IJECE

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Today, Hygroscopic swelling is one of the biggest challenging problem of Epoxy mold compound (EMC) in packaging with Microelectromechanical system (MEMS) devices. To overcome this hygroscopic swelling problem of EMC and guard the devices, MEMS devices are molded in this paper with different Mold Compound (MC) i.e. titanium and ceramic etc. during their interconnection with the board. Also, a comparatively performance analysis of this various mold compound with MEMS pressure sensor has been studied in this paper at 60% humidity, 140 mol/m<sup>3</sup> saturation concentration and 25 <sup>o</sup>C. It was observed that hygroscopic swelling does not take place in the titanium mold compound. But, titanium is very costly so we have to consider something cheaper material i.e. ceramic in this paper. The Hygroscopic swelling in Ceramic Mold Compound after 1 year is nearly 0.05mm which is very less than epoxy.

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Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

Cited by 27 publications

References 22 publications

Thermal-Performance Instability in Piezoresistive Sensors: Inducement and Improvement

Thermal-Performance Instability in Piezoresistive Sensors: Inducement and Improvement

Simulation of Gymnastics Performance Based on MEMS Sensor

Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials

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