This study reports on the interface and border trap characterization of HfO 2 films by incorporating Al 2 O 3 via atomiclayer deposition (ALD) in several deposition ratios. Al incorporation lowers the dielectric constant (k) of the HfO 2 film and reduces the frequency dispersion while providing a positive shift in the flat band voltage. X-ray photoelectron spectroscopy (XPS) analysis has validated the microstructural bonding formation, and a combination of XPS and reflected electron energy loss spectroscopy (REELS) was used to characterize the band structures of the films. The energy band gap (E g ) and barrier heights (E c and E v ) showed an increase with increasing amount of Al in the deposited films. Al 2 O 3 incorporation helps achieve better passivation than pure HfO 2 and provides pinhole-free condensed film growth, which is justified as a reduction in trap density. The reduction of the traps and band gap enlargement helps to obtain a lower leakage current density.