Investigation of subsurface damage of ground glass edges

Zhong, Zhang; Tian, Yebing; Xie, Tianwu

doi:10.1007/s00170-016-8733-y

Cited by 10 publications

(3 citation statements)

References 28 publications

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“…lass is a widely used material because of its optical properties, hardness, durability, and thermal and chemical stability. However, glass has no large deformation or toughening mechanism at ambient temperature, and as a result, its tensile strength is compromised by the slightest defects or damage (1), and it has poor impact resistance. A strategy to improve strength and impact resistance is tempering, in which compressive stresses are created at the surface of the component to hinder crack initiation, increasing strength to two to five times that of annealed glass (2).…”

mentioning

confidence: 99%

Impact-resistant nacre-like transparent materials

Yin

Hannard

Barthelat

2019

Science

329

211

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Glass has outstanding optical properties, hardness, and durability, but its applications are limited by its inherent brittleness and poor impact resistance. Lamination and tempering can improve impact response but do not suppress brittleness. We propose a bioinspired laminated glass that duplicates the three-dimensional “brick-and-mortar” arrangement of nacre from mollusk shells, with periodic three-dimensional architectures and interlayers made of a transparent thermoplastic elastomer. This material reproduces the “tablet sliding mechanism,” which is key to the toughness of natural nacre but has been largely absent in synthetic nacres. Tablet sliding generates nonlinear deformations over large volumes and significantly improves toughness. This nacre-like glass is also two to three times more impact resistant than laminated glass and tempered glass while maintaining high strength and stiffness.

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mentioning

confidence: 99%

Impact-resistant nacre-like transparent materials

Yin

Hannard

Barthelat

2019

Science

329

211

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“…Besides these two processes, a semi-ductile-regime grinding process may be attractive to industries (Zhong, 2000). Such research studies have been conducted in the past years (Zhong et al, 2016), but their applications for semiconductor and microelectronics industries are still lacking. For future work, more research studies with applications for these industries are needed to enhance the productivity and reduce the SSD at the same time.…”

Section: Suggestions For Future Workmentioning

confidence: 99%

Recent advances and applications of abrasive processes for microelectronics fabrications

Zhong

2019

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Purpose This paper aims to review recent advances and applications of abrasive processes for microelectronics fabrications. Design/methodology/approach More than 80 patents and journal and conference articles published recently are reviewed. The topics covered are chemical mechanical polishing (CMP) for semiconductor devices, key/additional process conditions for CMP, and polishing and grinding for microelectronics fabrications and fan-out wafer level packages (FOWLPs). Findings Many reviewed articles reported advanced CMP for semiconductor device fabrications and innovative research studies on CMP slurry and abrasives. The surface finish, sub-surface damage and the strength of wafers are important issues. The defects on wafer surfaces induced by grinding/polishing would affect the stability of diced ultra-thin chips. Fracture strengths of wafers are dependent on the damage structure induced during dicing or grinding. Different thinning processes can reduce or enhance the fracture strength of wafers. In the FOWLP technology, grinding or CMP is conducted at several key steps. Challenges come from back-grinding and the wafer warpage. As the Si chips of the over-molded FOWLPs are very thin, wafer grinding becomes critical. The strength of the FOWLPs is significantly affected by grinding. Originality/value This paper attempts to provide an introduction to recent developments and the trends in abrasive processes for microelectronics manufacturing. With the references provided, readers may explore more deeply by reading the original articles. Original suggestions for future research work are also provided.

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“…Glass is a material receiving high demand in mechanical, biomedical, electronic and photovoltaic applications because of its outstanding optical properties, hardness, durability and chemical stability. However, at ambient temperature, glass is a brittle material with little deformability, leading to poor reliability and low damage tolerance in these applications [1]. Thermal or chemical tempering can increase the strength of glass by two to five-fold [2], but tempered glass suffers from catastrophic and 'explosive' failure by even slightest damages.…”

Section: Introductionmentioning

confidence: 99%

Stiff, strong and tough laminated glasses with bio-inspired designs

Yin¹,

Barthelat²

2021

Bioinspir. Biomim.

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Glass is an attractive material with outstanding transparency, hardness, durability and chemical stability. However, the inherent brittleness and low toughness of glass limit its applications. Overcoming the brittleness of glass will help satisfy the rapidly increasing demands of glass in building materials, optical devices, electronics and photovoltaic systems, but it has been a challenge to create glass that is stiff, strong and tough while maintaining its transparency. In this study we explore how the basic design of laminated glass can be enriched with bio-inspired architectures generated with laser engraving. We assess the performance of designs based on continuous plies (90° cross plies, Bouligand), finite glass blocks (segmented Bouligand, nacre-like brick-and-mortar) and hybrid designs. It shows that simultaneous improvements of stiffness, strength and energy absorption upon continuous ply designs can be achieved by promoting delocalized shearing of the polymeric interlayer over brittle fracture of the glass building blocks, and by only placing enriched architectures under tensile deformation so that interlayer shearing can be realized. This principle can be realized simply by adjusting size and arrangement of the building blocks, and by combining continuous plain layers with architectured layers.

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Investigation of subsurface damage of ground glass edges

Cited by 10 publications

References 28 publications

Impact-resistant nacre-like transparent materials

Impact-resistant nacre-like transparent materials

Recent advances and applications of abrasive processes for microelectronics fabrications

Stiff, strong and tough laminated glasses with bio-inspired designs

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