2019
DOI: 10.1088/2053-1591/ab155f
|View full text |Cite
|
Sign up to set email alerts
|

Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2020
2020
2023
2023

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 44 publications
0
1
0
Order By: Relevance
“…Note that the use of classical lead–tin solders for the gold is limited due to the gold high solubility and the active formation of intermetallic compounds and embrittlement, which are typical for tin‐containing solders. [ 15–17 ] This is especially important for the needs of modern electronics, in which it is necessary to provide the preservation of the continuity of the conductive layers under exploitation process operation as well as during all technological processes, including soldering. In addition, there are some inconsistencies of the data and conclusions of various authors who studied the phase diagram of this contact pair.…”
Section: Introductionmentioning
confidence: 99%
“…Note that the use of classical lead–tin solders for the gold is limited due to the gold high solubility and the active formation of intermetallic compounds and embrittlement, which are typical for tin‐containing solders. [ 15–17 ] This is especially important for the needs of modern electronics, in which it is necessary to provide the preservation of the continuity of the conductive layers under exploitation process operation as well as during all technological processes, including soldering. In addition, there are some inconsistencies of the data and conclusions of various authors who studied the phase diagram of this contact pair.…”
Section: Introductionmentioning
confidence: 99%