2017 IEEE Energy Conversion Congress and Exposition (ECCE) 2017
DOI: 10.1109/ecce.2017.8096411
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Investigation of the RC-IGBT application in high speed railway converters

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Cited by 3 publications
(2 citation statements)
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“…For high-power electronic devices with large pad structures, factors such as temperature, vibration, and humidity are the main reasons for their failure, among which temperature accounts for the main part of the total failure of power devices [12]. This is because, as it withstands the action of high frequency, high voltage, and high current, the Power electronic devices, such as gate turn-off thyristors (GTO), high-power transistors (GTR), power MOSFETs, insulated gate bipolar transistors (IGBTs), and integrated gate commutator thyristors (IGCT), are the core components for motor control and power conversion to achieve high temperature, reliability, and long life.…”
Section: Introductionmentioning
confidence: 99%
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“…For high-power electronic devices with large pad structures, factors such as temperature, vibration, and humidity are the main reasons for their failure, among which temperature accounts for the main part of the total failure of power devices [12]. This is because, as it withstands the action of high frequency, high voltage, and high current, the Power electronic devices, such as gate turn-off thyristors (GTO), high-power transistors (GTR), power MOSFETs, insulated gate bipolar transistors (IGBTs), and integrated gate commutator thyristors (IGCT), are the core components for motor control and power conversion to achieve high temperature, reliability, and long life.…”
Section: Introductionmentioning
confidence: 99%
“…For high-power electronic devices with large pad structures, factors such as temperature, vibration, and humidity are the main reasons for their failure, among which temperature accounts for the main part of the total failure of power devices [12]. This is because, as it withstands the action of high frequency, high voltage, and high current, the solder joint temperature of the sandwich structure alternates between high and low, and the solder joint experiences a rapid temperature cycle, which makes the brittle intermetallic compound (IMC) between the solder joint interface grow rapidly.…”
Section: Introductionmentioning
confidence: 99%