Investigation of the Reliability of Copper Ball Bonds to Aluminum Electrodes

Onuki, Jin; Koizumi, Masahiro; Araki, I.

doi:10.1109/tchmt.1987.1134799

Cited by 53 publications

(33 citation statements)

References 10 publications

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“…This result was confirmed by the best Rietveld refinement (GOF = 1.27) of the pattern corresponding to MA powder for 6 h ( Figure 2c). In a previous work, Onuki et al [20] reported that the formation of the tetragonal-Al2Cu phase during mechanical milling is due to the negative enthalpy of the mixing of the Al-Cu system. Furthermore, the solubility of the solutes is enhanced with a grain refinement on the nanometer scale.…”

Section: X-ray Diffractionmentioning

confidence: 99%

Synthesis and Characterization of Nanocrystalline Al-20 at. % Cu Powders Produced by Mechanical Alloying

Makhlouf

Bachaga

Suñol

et al. 2016

Metals

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Mechanical alloying is a powder processing technique used to process materials farther from equilibrium state. This technique is mainly used to process difficult-to-alloy materials in which the solid solubility is limited and to process materials where nonequilibrium phases cannot be produced at room temperature through conventional processing techniques. This work deals with the microstructural properties of the Al-20 at. % Cu alloy prepared by high-energy ball milling of elemental aluminum and copper powders. The ball milling of powders was carried out in a planetary mill in order to obtain a nanostructured Al-20 at. % Cu alloy. The obtained powders were characterized using scanning electron microscopy (SEM), differential scanning calorimetry (DSC) and X-ray diffraction (XRD). The structural modifications at different stages of the ball milling are investigated with X-ray diffraction. Several microstructure parameters such as the crystallite sizes, microstrains and lattice parameters are determined.

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Section: X-ray Diffractionmentioning

confidence: 99%

Synthesis and Characterization of Nanocrystalline Al-20 at. % Cu Powders Produced by Mechanical Alloying

Makhlouf

Bachaga

Suñol

et al. 2016

Metals

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show abstract

“…The importance of achieving uniform, void free intermetallic growth in ball-bonded devices has resulted in many studies of gold-aluminium intermetallics [16, and copper-aluminium intermetallics [112][113][114][115][116][117][118][119][120][121][122][123][124][125][126][127]. The presence of voids and correlation of voids with wire pull and shear strength forms the basis of much of the published literature with some more recent exceptions that explore the microstructure [14,41,124].…”

Section: Concepts Of Phase Growth Between Metalsmentioning

confidence: 99%

A brief review of selected aspects of the materials science of ball bonding

Breach¹,

Wulff

2010

Microelectronics Reliability

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“…Onuki et al [21] compared reliability performance of gold and copper ball bonds after ageing at temperatures between 120°C and 200°C. Data from that study, in Fig.…”

Section: Reliability Studies 1980-2002mentioning

confidence: 99%

What is the future of bonding wire? Will copper entirely replace gold?

Breach¹

2010

Gold Bull

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Thermosonic ball bonding is a major interconnect process in microelectronics packaging and is positioned to remain one of the key process technologies available to package designers in the near future. However, the main wire material used in fine pitch (FP) and ultra-fine pitch (UFP) ball bonding is gold and with significant increases in gold price, gold ball bonding has become a more costly process that has a considerable economic effect on the assembly of packages used in consumer electronics. An alternative wire material to gold is copper, which is much cheaper and has several technical benefits including better electrical conductivity and has been widely used in discrete and power devices with wire diameters typically larger than 30μm in diameter for many years. However, copper wire behaves quite differently than gold due to its different physical properties, some of which are beneficial and others detrimental to bonding performance. In this article, we briefly review some of the advantages and difficulties with using copper wire advanced packaging and explain why copper cannot replace gold in many applications and why gold offers significant benefits.

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Investigation of the Reliability of Copper Ball Bonds to Aluminum Electrodes

Cited by 53 publications

References 10 publications

Synthesis and Characterization of Nanocrystalline Al-20 at. % Cu Powders Produced by Mechanical Alloying

Synthesis and Characterization of Nanocrystalline Al-20 at. % Cu Powders Produced by Mechanical Alloying

A brief review of selected aspects of the materials science of ball bonding

What is the future of bonding wire? Will copper entirely replace gold?

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