2009
DOI: 10.1016/j.solmat.2009.07.018
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Investigation of unusual shunting behavior due to phototransistor effect in n-type aluminum-alloyed rear junction solar cells

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Cited by 16 publications
(27 citation statements)
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“…Also the effect reported in Ref. 75 was finally attributed to a high−resistive area [78]. The effect described in Ref.…”
mentioning
confidence: 74%
See 1 more Smart Citation
“…Also the effect reported in Ref. 75 was finally attributed to a high−resistive area [78]. The effect described in Ref.…”
mentioning
confidence: 74%
“…It has been reported sometimes that the parallel resistance R p of a solar cell depends on the illumination intensity [75]. If the parallel resistance is measured as the inverse of the slope of the dark or illuminated characteristics at 0 V (which is ac− tually wrong even for homogeneous cells, see discussion of Eq.…”
mentioning
confidence: 99%
“…This effect, like departure 2 described by Robinson et al (1994), is proportional to the illumination intensity and vanishes for low intensity or in the dark. Also the effect reported in Sugianto et al (2009) was finally attributed to a high-resistive area (Sugianto et al, 2012). The effect described in Khan et al (2010) may be due to the fact that, in this work, only the 1-diode model according to Eq.…”
Section: Relation Between Dark and Illuminated Characteristicsmentioning
confidence: 72%
“…It has been reported sometimes that the parallel resistance R p of a solar cell depends on the illumination intensity (Sugianto et al, 2009). If the parallel resistance is measured as the inverse of the slope of the dark or illuminated characteristic at 0 V (which is actually wrong even for homogeneous cells, see discussion of Eq.…”
Section: Relation Between Dark and Illuminated Characteristicsmentioning
confidence: 99%
“…Although laser ablation requires less processing steps and is able to produce very fine lines, the laser parameters need to be tightly controlled to ensure the ARC layer is ablated without melting the underlying silicon and damaging the shallow emitter layer [6,7]. Both of these patterning techniques require optimization for use on both mono-Si and poly-Si substrates.…”
Section: Introductionmentioning
confidence: 99%