Investigation on high temperature mechanical fatigue failure behavior of SnAgCu/Cu solder joint

Zhu, Yongxin; Li, Xiaoyan; Wang, Chao; Gao, Ruiting

doi:10.1007/s10854-014-1746-0

Cited by 12 publications

(3 citation statements)

References 16 publications

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“…Equations (11), (13), and (15) establish the relationship of failure time and strain, strain amplitude of three chip solder joints failure modes, respectively. In this way, after the model parameters being modified by test and simulation data from coupled loads, traditional failure physical models can be applied in a wider range of complex environment instead of simple single stress.…”

Section: ⅳ Degredation Modeling Of Chip Solder Joint Based On Failurmentioning

confidence: 99%

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Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes

Jing

et al. 2020

IEEE Access

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Section: ⅳ Degredation Modeling Of Chip Solder Joint Based On Failurmentioning

confidence: 99%

“…After the degradation test, failure samples of solder joints can be analyzed. Some scholars studied the microstructure of solder joints [10] [11]by scanning electron microscope (SEM). However, it is not sufficient, just relying on microscopic cracks, to consider the mechanism of solder joint degradation.…”

Section: Introductionmentioning

confidence: 99%

Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes

Jing

et al. 2020

IEEE Access

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“…Some studies have observed the microstructure of solder joint at degradation and failure stage, and analyzed the crack initiation location and crack propagation mode. For example, Zhang [16] and Zhu et al [17] researched the failure mechanism through observation of the micro crack evolution and fracture shape. Some studies used finite element simulation to analyze the origin of cracks in solder joints.…”

Section: Introductionmentioning

confidence: 99%

Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress

Jing

2020

Materials

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The chip is the core component of the integrated circuit. Degradation and failure of chip solder joints can directly lead to function loss of the integrated circuit. In order to establish the degradation model of chip solder joints under coupled stress, this paper takes quad flat package (QFP) chip solder joints as the study object. First, solder joint degradation data and failure samples were obtained through fatigue tests under coupled stress. Three types of micro failure modes of solder joints were obtained by scanning electron microscope (SEM) analysis and finite element model (FEM) simulation results. Second, the characterization of degradation data was obtained by the principal component of Mahalanobis distance (PCMD) algorithm. It is found that solder joint degradation is divided into three stages: strain accumulation stage, crack propagation stage, and failure stage. Later, Coffin–Manson model and Paris model were modified based on the PCMD health index and strain simulation. The function relationship between strain accumulation time, crack propagation time, and strain was determined, respectively. Solder joint degradation models at different degradation stage were established. Finally, through strain simulation, the models can predict the strain accumulation time and failure time effectively under each failure mode, and their prediction accuracy is above 85%.

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Effect of hold time on the mechanical fatigue failure behavior of lead-free solder joint under high temperature

Zhu

Gao

et al. 2014

J Mater Sci: Mater Electron

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Investigation on high temperature mechanical fatigue failure behavior of SnAgCu/Cu solder joint

Cited by 12 publications

References 16 publications

Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes

Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes

Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress

Effect of hold time on the mechanical fatigue failure behavior of lead-free solder joint under high temperature

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