Investigation on modified jet electrochemical machining of micro-channel

Chen, X. L.; Dong, Bangyan; Fan, Guochao; Zhang, C. Y.; Liu, J. W.; Zhang, Y. J.; Guo, Ziwen

doi:10.1007/s00170-019-04312-x

Cited by 8 publications

(3 citation statements)

References 18 publications

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“…The electrolytic products were generated by reactions during machining time, and the products were removed during rest time. 30 The higher voltage increased the concentration of reaction products which may inhibit the continuous anodic dissolution, 48 and thus was not suitable for the figuring process. Therefore, the voltage of 3.5 V with a frequency of 10 kHz and a 50% duty ratio was applied to achieve high accuracy and stability combined with high MRR.…”

Section: Resultsmentioning

confidence: 99%

“…19,23,24 Based on the high machining flexibility of Jet-ECM 25 and the principle of computer-controlled optical surfacing (CCOS), through controlling the trajectory and dwelling time of the nozzle, the amount of material removal at different positions of the workpiece can be manipulated. [26][27][28] Therefore, Jet-ECM can manufacture flat or wavy surfaces 19 as well as various kinds of structures on the workpiece such as pits, 26,29 grooves, 30,31 or other complex structures 32,33 for different industrial applications. In previous studies, Natsu et al (2007) 32 proposed an algorithm to obtain the nozzle traveling path and scanning speed to generate a complicated groove (diameter: 2 mm, depth: 100 μm) by superimposing simple patterns.…”

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confidence: 99%

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Preparation of Flat and Smooth Copper Surface by Jet Electrochemical Machining and Electrochemical Polishing

Wang

Yan

Zhou

et al. 2020

J. Electrochem. Soc.

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Ultra-flat and ultra-smooth copper (Cu) surfaces are widely used as optical mirrors, heat sinks, and substrates for functional material growth. Traditional polishing methods that rely on abrasive particles are easy to induce mechanical defects such as abrasives embedding and scratches on surfaces. A new stress-free machining process is proposed in this research to fabricate an ultra-flat and ultra-smooth Cu surface by combining jet electrochemical machining (Jet-ECM) and electrochemical polishing (ECP). With the accurate manipulating of material removal rate (MRR) and planning of nozzle trajectory, an ultra-flat surface can be obtained efficiently in the Jet-ECM process. The surface roughness of the workpiece can be further improved by ECP with the same electrolyte used in the Jet-ECM process. The results show that the surface peak-to-valley (PV) value which indicated the surface form error of the Cu surface was reduced from 4.4 μm to 1.7 μm and the surface roughness Sa was reduced from 70.3 nm to 13.5 nm. The combination of Jet-ECM and ECP which share the same electrolyte and apparatus can improve the surface flatness and roughness significantly. This study improves the machining accuracy of stress-free machining methods and has great implications for the further understanding of the electrochemical removal mechanism.

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Section: Resultsmentioning

confidence: 99%

mentioning

confidence: 99%

Preparation of Flat and Smooth Copper Surface by Jet Electrochemical Machining and Electrochemical Polishing

Wang

Yan

Zhou

et al. 2020

J. Electrochem. Soc.

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show abstract

“…In addition to using multiple nozzles, Chen et al [84,85] applied flexible insulated masks to a slot jet in EJM, to enable the creation of micro groove arrays (Fig. 16b-e).…”

Section: Multiple Nozzle Arraysmentioning

confidence: 99%