Investigation on PA/PP mixture properties by means of DMTA method

This paper presents the influence of deformation rate on the stress-strain curves for two polymers, Polyamide 6 (PA6) and polypropylene (PP), tensile samples being supplied by Monofil SRL Săvinești, Romania. Tensile tests were done at INCAS Bucharest and the presented results are values obtained on 5 bone samples. There were analyzed the following characteristics: Young modulus, stress peak at break, elongation at break and energy at break. Greater deformation rates, when testing at traction, rises the tensile stress limit and diminishes the strain at which the polymer samples break. PA6 and PP exhibit different behaviors. PA6 yields at very low deformation rate, having a high strain at break (0.9) when it is tested at 10 mm/min, but reducing this characteristic for higher deformation rates. PP has similar curves for the tested deformation rates, but with lower tensile stress limit when tested under lower deformation rate. These data are useful when designing polymeric components bearing different strain rates.

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“…Values of mechanical characteristics for these two polymers are useful for evaluating their change when blending them [13], [11].…”

Section: Resultsmentioning

confidence: 99%

Tensile Tests for Polyamide 6 and Polypropilene

Musteata¹,

Pelin²,

Botan³

et al. 2019

UDJG_MTD

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“…The features of modified material depend on structural factors of polymer as well as added modifier. The structural factors are mainly molecular weight, macromolecular chemical structure, physical layout of a chain, crystallinity, and molecular orientation while conditions of use are temperature, load time, pressure, strain type, and so on [14][15][16][17][18][19]. Estimation of possible feature changes of these materials with added modifiers plays important role in polymer materials composition.…”

Section: Introductionmentioning

confidence: 99%

“…It is used to measure the relaxation modules versus time with constant temperature and as a function of load change frequency and temperature [16,[19][20][21][22]. Mechanical characteristics obtained for statical load at room temperature are not adequate to estimate material's features in any other conditions of usage [16,[19][20][21][22]. The way to recognise all properties of tested materials and estimate their behaviour in predicted usage conditions is to obtain for them viscoelastic functions that contain all required thermal and time dependencies.…”

Section: Introductionmentioning

confidence: 99%

Influence of the Copper-Containing SBA-15 Silica Fillers on the Mechanical Properties of High Density Polyethylene

Gnatowski¹,

Jelonkiewicz

Laskowski³

et al. 2016

Journal of Nanomaterials

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The paper concerns the mechanical properties of the high density polyethylene (HDPE) with the copper-containing SBA-15 silica filler. The considered filler is the SBA-15 mesoporous silica containing copper ions bounded inside channels via propyl-phosphonate anchoring groups. With its help, we can impart the biocidal properties to this plastic. Research covered mechanical properties, thermal analysis, colour, shine, and nanomolecular structure. Dynamical properties of the samples like modulusE′changes and mechanical core loss angle tangenttgδversus temperature and vibration frequency were tested using DMTA method. Level of crystallinity was tested using DSC method while their structure was observed with going through light by optical microscope. Hardness and toughness of obtained samples were also defined. Colour and shine changes of the samples were observed for PE-HD with filler contents 0.5% and 1%. Modulus value changes versus temperature and frequency were notified for the samples with modifier. There were no differences in modulus changes versus temperature for samples with and without filler and frequencies 1 and 10 Hz. It was detected that melting enthalpy of the samples with the modifier decreases. Moreover, some influence of the samples with filler on colour and shine was observed.

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“…Curing temperature and curing period is the variables in curing process. The degree of cross-linking during the curing process could affect the mechanical properties of ICAs, such as hardness, flexibility, impact resistance, the appearance of the film and damping factor of the cured film [2], [3].…”

Section: Introductionmentioning

confidence: 99%

Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives

Durairaj

Sean

Chiun

et al. 2013

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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Isotropic conductive adhesive (ICAs) are considered as the most promising replacement to lead or lead free solders due to relatively low melting point, simple processing, low processing temperature and fine pitch capability. The study aims to instigate the dynamic mechanical and thermal properties of diglycidylether of bisphenol-A (DGEBA) and polyurethane (PU) based ICAs. Dynamic mechanical thermal analysis (DMTA) is one of the ways to estimate changes, which occur for polymeric materials in the broad range of temperature and frequency of changes in load. In this study, the results showed that measurement of storage modulus, loss modulus and also damping factor of the samples formulated with DGEBA has better thermal mechanical properties than the samples formulated with PU. In addition, by changing the conventional silver flakes to silver nanoparticles; the results shows that nanoparticles make a little improvement in thermal mechanical properties for the temperature beyond T g. For silver flake formulation with DGEBA, the result shown that the samples with higher volume fraction of silver flake shows a better thermal mechanical properties.

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Investigation on PA/PP mixture properties by means of DMTA method

Cited by 21 publications

References 4 publications

Tensile Tests for Polyamide 6 and Polypropilene

Tensile Tests for Polyamide 6 and Polypropilene

Influence of the Copper-Containing SBA-15 Silica Fillers on the Mechanical Properties of High Density Polyethylene

Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives

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