Investigation on Spraying Uniformity in Etching Process of FPCB with 18 μm Line Pitch

Ming, Ruijian; Li, Hui; Chen, Aojie; Sheng, Jiazheng; Sun, Bin; Wang, Jian; Huang, Chun‐Sheng; Yang, Jie

doi:10.1007/s12541-022-00636-z

Cited by 4 publications

(1 citation statement)

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“…Bearing the benefits of good portability [ 1 ], light weight, small size, and excellent bending performance, flexible printed circuit boards (FPCBs) are widely used in mobile communication equipments, flexible wearable devices [ 2 ], and automotive electronic products [ 3 ]. With increasing demand in the FPCB market, the photolithography process [ 4 ] has been a crucial driving force for achieving a narrower FPCB line pitch.…”

Section: Introductionmentioning

confidence: 99%

Investigation into Photolithography Process of FPCB with 18 µm Line Pitch

Sun

Liang

et al. 2023

Micromachines

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Due to the widespread application of flexible printed circuit boards (FPCBs), attention is increasing being paid to photolithography simulation with the continuous development of ultraviolet (UV) photolithography manufacturing. This study investigates the exposure process of an FPCB with an 18 µm line pitch. Using the finite difference time domain method, the light intensity distribution was calculated to predict the profiles of the developed photoresist. Moreover, the parameters of incident light intensity, air gap, and types of media that significantly influence the profile quality were studied. Using the process parameters obtained by photolithography simulation, FPCB samples with an 18 µm line pitch were successfully prepared. The results show that a higher incident light intensity and a smaller air gap result in a larger photoresisst profile. Better profile quality was obtained when water was used as the medium. The reliability of the simulation model was validated by comparing the profiles of the developed photoresist via four experimental samples.

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