Investigative Study of Manifold Microchannel Heat Sinks for Electronic Cooling Design

Abstract

Advances in microfabrication technology have allowed the use of microchannels in ultra compact, very efficient heat exchangers, which capitalize on the channels large surface area to volume ratio to transport high heat fluxes with small thermal resistances. One example is the cooling of microchips. However, the research into microscale flow and heat transfer phenomena conducted by various researchers provided substantial experimental data and considerable evidence that the behaviour of fluid flow and heat transfer in microchannels without phase change may be different than that which normally occurs in larger more conventional sized channels.This paper serves to perform a numerical analysis on the flow and heat transfer in manifold microchannels. A numerical model for 16 sets of parametric conditions is presented here using a CFD package, ANSYS/FLOTRAN. Pressure, temperature and velocity contour plots were obtained and analyzed. The results obtained were then compared with a derived analytical model. The predictions showed a large dependence on the flow rate. Differences in values and trends were expected as the analytical model assumed a straight channel unlike a manifold channel. Further comparisons were also made regarding the relationship between Reynolds number and the friction factor. Data were also compared with Copeland's simulation (1995) using FLUENT software and the agreement is good.

Next Generation Microchannel Heat Exchangers

“…Second, the secondary local maxima starts to appear close to the impingement zones under the inlet and outlet feed channels. Similar local high heat transfer zones were reported by Copeland (1995), Copeland et al (1997) and Ng and Poh (1999). Close to the impingement zones, the local fluid acceleration and vortices created during the flow turning have the effect of reducing the thermal Finally, the surface temperature distributions on the fin surface, microchannel base, and middle of the base material are shown in Fig.…”

“…The geometrical design that delivered the lowest thermal resistance was compared with a traditional microchannel heat sink, and it was found that the FFMHX design would work with 35 % less thermal resistance at the same pumping power. Ng and Poh (1999) analyzed thermal performance of FFMHXs numerically for 16 cases with different geometrical dimensions and flow conditions. The numerical model was validated by the experimental results of Copeland (1995).…”

Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics

“…Manifold microchannel heat sinks were first suggested in Harpole and Eninger [8] and numerically studied by Copeland et al [9] and Ng and Poh [10]. Compared to conventional microchannel heat sinks, manifold microchannel heat sinks feature many inlet and outlet manifolds, alternating at a periodic distance along the length of the microchannels.…”

Research progress of the liquid cold plate cooling technology for server electronic chips: A review

“…Among variable geometric parameters affecting the performance of microchannels, the channel width and height are crucial factors 21‐23 . Since the geometry of the channel cross‐section is collectively determined by both width and height, a dimensionless parameter, aspect ratio () has been introduced to investigate the effects of microchannel geometry on flow and heat transfer performance.…”