ION BEAM (Cu–Pb–Sn) IMPLANTATION OF SURFACE LAYER OF 30ChGSN2A

Abstract

Electron microscopy studies were conducted for the fine structure of ion-doped layer on 30ChGSN2A steel obtained by ion implantation of monotectic tin-doped copper–lead alloy Cu64Pb36[Formula: see text]Sn. Formation of a multi-level hierarchical structure was detected. The features of formation of each layer were analyzed, and it was found that the main mechanism of formation of these structures is diffusion and relaxation resulting in the occurrence of internal stresses both in the surface layer and in the sheet of 30ChGSN2A steel. Relaxation of elastic stress fields results in translational–rotational deformation forming various vortex structures.

Study of surface layers obtained by copper ion implantation into a target of steel 30хгсн2а by auger Spectroscopy methods

“…Copper implantation in steel plates was carried out in this work at the accelerating voltage of 30 keV. As is known, at such voltage, the elastic contribution to the braking process of the implantable particles [20] dominates and the distribution in depth is described by the Gauss function. The obtained concentration dependence of copper in depth was approximated with the help of function…”

“…Thus, the ion implantation at elevated temperatures, but below the temperatures at which mechanical properties are degraded, allows for a significant increase in the penetration depth of the alloying element [8,9]. Papers [11][12][13][14][15][16][17][18][19][20][21][22][23][24][25] show the possibility of increasing the tribological properties of products from steel 30ХГСН2А by implantation into their working surfaces the copper ions and the processing conditions that enhance the durability of these products have been determined. When testing samples for a linear wear it was determined that implantation of copper ions allows increasing the wear resistance by 2.5 times.…”