Ion-Beam Machining of Tungsten Carbide Chips — Fabrication of Fine Patterns

Miyamoto, Iwao; Shuhara, A.; Taniguchi, Nobuhiko

doi:10.1016/s0007-8506(07)61964-7

Cited by 8 publications

(1 citation statement)

References 3 publications

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“…Up to now there have been only few data on the machining of WC-Co cemented carbides by FIB, 12) although there have been several reports on machining by ion shower beam. [13][14][15] It is known that rough surfaces cause a significant reduction in the service properties of microcomponents. 16) Because the sputtering rate is affected by the microstructural properties, 10,11) the surface roughness of a WC-Co cemented carbide micro-die machined by FIB will also be affected by the microstructures.…”

Section: Introductionmentioning

confidence: 99%

Effects of the WC Grain Size on the Surface Roughness of WC-10%Co Cemented Carbide Micro-Die Machined by FIB

et al. 2002

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Micro-dies with five steps were fabricated by machining with the focused ion beam (FIB) process using two types of WC-10%Co cemented carbide with a WC grain size of 5 µm and 0.5 µm. The surface roughness of the dies was investigated by atomic force microscopy (AFM). In the coarse-grained cemented carbide, the surfaces of the WC phase were very smooth. However, those of the Co phase were rough, particularly near the interface. In the fine-grained cemented carbide, the surfaces were smoother on the whole and the irregularities of roughness were smaller compared with the coarse-grained cemented carbide, but some voids of about 0.5 µm, almost the same size as the WC grain, were observed.

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