Ion projection lithography below 70 nm: tool performance and resist process

Hirscher, Stefan; Kümmel, M.; Kirch, Oliver; Domke, Wolf-Dieter; Wolter, Andreas; Käsmaier, R.; Buschbeck, H.; Cekan, E.; Chalupka, A.; Chylik, A.; Eder, Sabrina; Horner, C.; Löschner, H.; Nowak, R.; Stengl, G.; Windischbauer, T.; Zeininger, M.

doi:10.1016/s0167-9317(02)00529-4

Cited by 15 publications

(5 citation statements)

References 5 publications

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“…A beam of ions uniformly illuminates a large-area, robust, patterned stencil mask, and the transmitted beam is projected using electrostatic lenses, at an image reduction factor of one or two orders of magnitude, on to the workpiece surface. Working in a European consortium with combined expertise in ion projections optics, 8 stencil mask production, 18 and high contrast resist development, 19 IMS have succeeded in patterning at 50 nm resolution in parts of the exposure field, and 75 nm over the full field of 12.5 × 12.5 sq mm, 19 in a single beam exposure. The same group has also developed a variation to IPL which they call ion projection direct structuring (IPDS).…”

Section: Ion Projection Lithography (Ipl)mentioning

confidence: 99%

Ion Beam Lithography and Nanofabrication: A Review

et al. 2005

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To overcome the diffraction constraints of traditional optical lithography, the next generation lithographies (NGLs) will utilize any one or more of EUV (extreme ultraviolet), X-ray, electron or ion beam technologies to produce sub-100 nm features. Perhaps the most under-developed and under-rated is the utilization of ions for lithographic purposes. All three ion beam techniques, FIB (Focused Ion Beam), Proton Beam Writing (p-beam writing) and Ion Projection Lithography (IPL) have now breached the technologically difficult 100 nm barrier, and are now capable of fabricating structures at the nanoscale. FIB, p-beam writing and IPL have the flexibility and potential to become leading contenders as NGLs. The three ion beam techniques have widely different attributes, and as such have their own strengths, niche areas and application areas. The physical principles underlying ion beam interactions with materials are described, together with a comparison with other lithographic techniques (electron beam writing and EUV/X-ray lithography). IPL follows the traditional lines of lithography, utilizing large area masks through which a pattern is replicated in resist material which can be used to modify the near-surface properties. In IPL, the complete absence of diffraction effects coupled with ability to tailor the depth of ion penetration to suit the resist thickness or the depth of modification are prime characteristics of this technique, as is the ability to pattern a large area in a single brief irradiation exposure without any wet processing steps. p-beam writing and FIB are direct write (maskless) processes, which for a long time have been considered too slow for mass production. However, these two techniques may have some distinct advantages when used in combination with nanoimprinting and pattern transfer. FIB can produce master stamps in any material, and p-beam writing is ideal for producing three-dimensional high-aspect ratio metallic stamps of precise geometry. The transfer of large scale patterns using nanoimprinting represents a technique of high potential for the mass production of a new generation of high area, high density, low dimensional structures. Finally a cross section of applications are chosen to demonstrate the potential of these new generation ion beam nanolithographies.

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Section: Ion Projection Lithography (Ipl)mentioning

confidence: 99%

Ion Beam Lithography and Nanofabrication: A Review

et al. 2005

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“…For this reason projection systems have been developed using a stencil mask (Hirscher et al, 2002). A broad helium beam is extracted from a plasma source.…”

Section: Ion Projection Systemsmentioning

confidence: 99%

Focused Ion Beam Lithography

Wanzenboeck¹,

Waid²

2011

Recent Advances in Nanofabrication Techniques and Applications

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“…Common ion energies range from 70 to 150 keV (Chen and Pepin 2001). Fabricated features of the order of 50 nm have been reported (Hirscher et al 2002). …”

Section: Nanofabrication Techniquesmentioning

confidence: 99%

Micro- and nanofabrication methods in nanotechnological medical and pharmaceutical devices

Betancourt¹,

Brannon-Peppas²

2006

International Journal of Nanomedicine

139

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Micro-and nanofabrication techniques have revolutionized the pharmaceutical and medical fi elds as they offer the possibility for highly reproducible mass-fabrication of systems with complex geometries and functionalities, including novel drug delivery systems and bionsensors. The principal micro-and nanofabrication techniques are described, including photolithography, soft lithography, fi lm deposition, etching, bonding, molecular self assembly, electrically induced nanopatterning, rapid prototyping, and electron, X-ray, colloidal monolayer, and focused ion beam lithography. Application of these techniques for the fabrication of drug delivery and biosensing systems including injectable, implantable, transdermal, and mucoadhesive devices is described.

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Ion projection lithography below 70 nm: tool performance and resist process

Cited by 15 publications

References 5 publications

Ion Beam Lithography and Nanofabrication: A Review

Ion Beam Lithography and Nanofabrication: A Review

Focused Ion Beam Lithography

Micro- and nanofabrication methods in nanotechnological medical and pharmaceutical devices

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