Ionization by microwave electron cyclotron resonance plasma

Holber, W. M.

doi:10.1016/s1079-4050(00)80006-x

Cited by 5 publications

(3 citation statements)

References 66 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The sputtered species travel through this dense plasma on their path toward the substrate and some become ionized. This IPVD technique has also been demonstrated for thermal evaporated metal that was ionized by passing through an ECR discharge (Holber 2000, Holber et al 1993.…”

Section: Magnetron Sputtering With a Secondary Dischargementioning

confidence: 99%

Physics and technology of magnetron sputtering discharges

Guðmundsson

2020

Plasma Sources Sci. Technol.

356

219

View full text Add to dashboard Cite

Magnetron sputtering deposition has become the most widely used technique for deposition of both metallic and compound thin films and is utilized in numerous industrial applications. There has been a continuous development of the magnetron sputtering technology to improve target utilization, increase ionization of the sputtered species, increase deposition rates, and to minimize electrical instabilities such as arcs, as well as to reduce operating cost. The development from the direct current (dc) diode sputter tool to the magnetron sputtering discharge is discussed as well as the various magnetron sputtering discharge configurations. The magnetron sputtering discharge is either operated as a dc or radio frequency discharge, or it is driven by some other periodic waveforms depending on the application. This includes reactive magnetron sputtering which exhibits hysteresis and is often operated with an asymmetric bipolar mid-frequency pulsed waveform. Due to target poisoning the reactive sputter process is inherently unstable and exhibits a strongly non-linear response to variations in operating parameters. Ionized physical vapor deposition was initially achieved by adding a secondary discharge between the cathode target and the substrate and later by applying high power pulses to the cathode target. An overview is given of the operating parameters, the discharge properties and the plasma parameters including particle densities, discharge current composition, electron and ion energy distributions, deposition rate, and ionized flux fraction. The discharge maintenance is discussed including the electron heating processes, the creation and role of secondary electrons and Ohmic heating, and the sputter processes. Furthermore, the role and appearance of instabilities in the discharge operation is discussed.

show abstract

Section: Magnetron Sputtering With a Secondary Dischargementioning

confidence: 99%

Physics and technology of magnetron sputtering discharges

Guðmundsson

2020

Plasma Sources Sci. Technol.

356

219

View full text Add to dashboard Cite

show abstract

“…Then, the evaporated flux is directed through an electrodeless discharge as it travels toward the substrate. This has been demonstrated using electron cyclotron resonance (ECR) discharge to ionize the copper vapor that was thermally evaporated (Holber 2000, Holber et al 1993. This setup is shown in figure 5.…”

Section: Thermal Evaporationmentioning

confidence: 99%

“…This IPVD technique has also been demonstrated for ionizing thermally evaporated metal by having it pass through an ECR discharge (Holber 2000, Holber et al 1993 as discussed in section 2.1. For sputter deposition systems, based on a secondary high density discharge, it has been reported that a significant fraction of the sputtered species is ionized and that the ionized flux fraction increases with increased power to the secondary discharge.…”

Section: Ionized Physical Vapor Deposition and Ionizationmentioning

confidence: 99%

Foundations of physical vapor deposition with plasma assistance

Guðmundsson

Anders

Keudell

2022

Plasma Sources Sci. Technol.

View full text Add to dashboard Cite

Physical vapor deposition (PVD) refers to the removal of atoms from a solid or a liquid by physical means, followed by deposition of those atoms on a nearby surface to form a thin film or coating. Various approaches and techniques are applied to release the atoms including thermal evaporation, electron beam evaporation, ion-driven sputtering, laser ablation, and cathodic arc-based emission. Some of the approaches are based on a plasma discharge, while in other cases the atoms composing the vapor are ionized either due to the release of the film-forming species or they are ionized intentionally afterwards. Here, a brief overview of the various PVD techniques is given, while the emphasis is on sputtering, which is dominated by magnetron sputtering, the most widely used technique for deposition of both metallic and compound thin films. The advantages and drawbacks of the various techniques are discussed and compared.

show abstract