IR-sintering of ink-jet printed metal-nanoparticles on paper

Tobjörk, Daniel; Aarnio, Harri; Pulkkinen, Petri; Bollström, Roger; Määttänen, Anni; Ihalainen, Petri; Mäkelä, Tapio; Peltonen, Jouko; Toivakka, Martti; Tenhu, Heikki; Österbacka, Ronald

doi:10.1016/j.tsf.2011.10.017

Cited by 147 publications

(121 citation statements)

References 43 publications

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“…[148][149][150] Denneulin et al used an IR lamp operating at wavelengths of 8 to 15 mm in order to sinter a Ag NP ink aer inkjet-printing. [148][149][150] Denneulin et al used an IR lamp operating at wavelengths of 8 to 15 mm in order to sinter a Ag NP ink aer inkjet-printing.…”

Section: Infra-red (Ir) Sinteringmentioning

confidence: 99%

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

Wünscher¹,

Abbel²,

Perelaer³

et al. 2014

J. Mater. Chem. C

249

222

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Well-defined high resolution structures with excellent electrical conductivities are key components of almost every electronic device. Producing these by printing metal based conductive inks on polymer foils represents an important step forward towards the manufacturing of plastic electronic products on an industrial scale. The development of fast, efficient and inexpensive post-deposition sintering technologies for these materials is an important processing step to make this approach commercially viable. This review discusses the advances in alternative sintering approaches for conductive, metal containing inks, which can be processed by inkjet-printing processes. Each sintering approach is examined regarding its mechanism, its compatibility with commonly used materials in the field of flexible electronics, its compatibility with high-throughput manufacturing processes and its applicability to the production of flexible electronic devices.

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Section: Infra-red (Ir) Sinteringmentioning

confidence: 99%

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

Wünscher¹,

Abbel²,

Perelaer³

et al. 2014

J. Mater. Chem. C

249

222

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“…This energy source requires improved control for welding of nanomaterials. Recently, the use of a tungsten 40,177 or xenon 178,179 lamp was demonstrated in fabricating large area conductive electrodes or thin films on paper and plastic substrates. Camera flash has also been used as light source to sinter Ag NP tracks 180,181 or reduce the sheet resistance of Ag NW electrodes for foldable paper electronic 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 42 application 182 .…”

Section: Optical Welding: Localized Plasmonic Heatingmentioning

confidence: 99%

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Peng¹,

Gerlich³

et al. 2015

ACS Appl. Mater. Interfaces

300

121

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A review is provided, which first considers low-temperature diffusion bonding with silver nanomaterials as filler materials via thermal sintering for microelectronic applications, and then other recent innovations in low-temperature joining are discussed. The theoretical background and transition of applications from micro to nanoparticle (NP) pastes based on joining using silver filler materials and nanojoining mechanisms are elucidated. The mechanical and electrical properties of sintered silver nanomaterial joints at low temperatures are discussed in terms of the key influencing factors, such as porosity and coverage of substrates, parameters for the sintering processes, and the size and shape of nanomaterials. Further, the use of sintered silver nanomaterials for printable electronics and as robust surface-enhanced Raman spectroscopy substrates by exploiting their optical properties is also considered. Other low-temperature nanojoining strategies such as optical welding of silver nanowires (NWs) through a plasmonic heating effect by visible light irradiation, ultrafast laser nanojoining, and ion-activated joining of silver NPs using ionic solvents are also summarized. In addition, pressure-driven joining of silver NWs with large plastic deformation and self-joining of gold or silver NWs via oriented attachment of clean and activated surfaces are summarized. Finally, at the end of this review, the future outlook for joining applications with silver nanomaterials is explored.

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“…A few approaches exist to alleviate the crack phenomenon observed. One possibility is to adopt a localised curing of the silver traces [55][56][57] such as laser sintering or the use of a xenon flash lamp. This has been adopted for the thermal sintering of silver traces on temperature sensitive substrates and is thus a possibility for fabric substrates.…”

Section: Printability and Measurable Resistancementioning

confidence: 99%

Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces

Lim

Goh

Liu

et al. 2015

Surface and Coatings Technology

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Citation: LIM, Y.Y. ... et al, 2015. Surface modification of an ambient UVcured dielectric to realise electrically conducting traces. Surface and Coatings Technology, 266, Additional Information:• This article was accepted for publication in the journal, Surface and Coat- AbstractThere has been much interest in the printing of silver inks onto flexible substrates, for which intermediate dielectric layers are often required to achieve suitable wettability. This work seeks to realize continuous silver traces overprinted onto UV-curable dielectrics through surface modification techniques (thermal and UV-ozone post treatments), when the UV light source used for the curing is non-optimal. Two UV curable dielectric materials were deposited and the effects of curing time and curing atmosphere on the inkjet printability of a commercially available silver ink were investigated. Good wettability of the silver ink was obtained following ozone treatment of the dielectric layers, where the treatment required was found to be a function of the dielectric formulation and the curing atmosphere. Water droplet contact angle measurements were used to analyse the resulting changes in the surface conditions of the dielectric layers. The results provided an indication, but were not sufficient for predicting whether silver traces with measurable resistance could be subsequently obtained. Instead, measurable silver trace resistances were found to be influenced by the occurrence of cracks in the trace and possibly the degree of cross-linking present in the dielectric. Following these results, the authors demonstrate that electrically conductive traces can be achieved on ambient cured samples, which yields a more flexible solution compared to inert cured samples.

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IR-sintering of ink-jet printed metal-nanoparticles on paper

Cited by 147 publications

References 43 publications

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces

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