Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Abstract

A review is provided, which first considers low-temperature diffusion bonding with silver nanomaterials as filler materials via thermal sintering for microelectronic applications, and then other recent innovations in low-temperature joining are discussed. The theoretical background and transition of applications from micro to nanoparticle (NP) pastes based on joining using silver filler materials and nanojoining mechanisms are elucidated. The mechanical and electrical properties of sintered silver nanomaterial joints at low temperatures are discussed in terms of the key influencing factors, such as porosity and coverage of substrates, parameters for the sintering processes, and the size and shape of nanomaterials. Further, the use of sintered silver nanomaterials for printable electronics and as robust surface-enhanced Raman spectroscopy substrates by exploiting their optical properties is also considered. Other low-temperature nanojoining strategies such as optical welding of silver nanowires (NWs) through a plasmonic heating effect by visible light irradiation, ultrafast laser nanojoining, and ion-activated joining of silver NPs using ionic solvents are also summarized. In addition, pressure-driven joining of silver NWs with large plastic deformation and self-joining of gold or silver NWs via oriented attachment of clean and activated surfaces are summarized. Finally, at the end of this review, the future outlook for joining applications with silver nanomaterials is explored.

3D Printing of Conductive Complex Structures with In Situ Generation of Silver Nanoparticles

“…Thus, it is possible to envisage the employment of these formulations for tailored applications in which charge accumulation could be detrimental (i.e., electronics) or in which controlled release of charge is desired. Furthermore, it is possible to foresee a local decrease of the resistance by applying low temperature sintering techniques …”

Applicability of photonic sintering and autoclaving as alternative contact formation methods for silicon solar cells with passivating contacts

“…Typically, flashes of light of a broad emission spectrum and with a peak in the ultraviolet wavelength range are used. The radiation is absorbed by metal particles which results in a sintering process [21][22][23][24] mainly controlled by the intensity of the radiation and its duration [11]. Additionally, metal particle size and shape plays a role for sintering behaviour.…”

Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering

“…17 shows that the shear strengths of joints sintered with mixed Ag NP þ Ag NW with 10% Cu NP pastes increased with the sintering temperature and applied pressure. The shear strength of joints was significantly affected by the applied pressure through accelerating the densification and providing larger driving force during the sintering of nanomaterials than that the case of reaction without sintering pressure [6,27]. The structure became denser and the porosity of sintered mixed paste was decreased when the sintering temperature and pressure were increased.…”