Isolating failing sites in IC packages using time domain reflectometry: Case studies

Abessolo-Bidzo, Dolphin; Poirier, Patrick; Descamps, Philippe; Domengès, B.

doi:10.1016/j.microrel.2005.07.068

Cited by 11 publications

(8 citation statements)

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“…It employs a pulse generator and high-speed oscilloscope to record the reflection of the signal at the open barrier in real time [2]. TDR can at best provide spatial resolution of about 1 mm [1]. Modification of the TDR technique involves taking data in the frequency domain with the Vector Network Analyzer (VNA) [6].…”

Section: Figure 1 the Bathtub Curvementioning

confidence: 99%

“…In the 1960s, the drive for higher reliability forced most design organisations to initiate reliability analysis and prediction as an integral part of design process. In 1962, the US Navy published the first version of a most famous handbook, MIL-HDBK-217, Reliability 1 The usefulness of a reliability prediction is a dependent on how well the prediction satisfies the users' objectives. However, the accuracy of the prediction results is dependent on the Prediction of Electronic Equipment.…”

Section: Introductionmentioning

confidence: 99%

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Reliability Trends of New ICs Generations

Titu-Marius¹

2020

EEA

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Reliability is the ability of a part or product to perform as intended (i.e., without failure and within specified performance limits) for a specified time, in its life cycle application environment. Reliability specification and demonstration is an activity between customers and suppliers. Because high IC reliability is an inherent quality that is partly derived not only from the soundness of the IC chip's design, but also from the degree of process control and cleanliness and the integrity of the IC-chip package and interconnections, failures tend to be lot-related. So, although a good reliability track record for one vendor's IC type means a reasonable probability that the vendor's next shipped lot of the same IC type will have the same high-reliability characteristics; there is no guarantee that such a lot will not exhibit abnormally high failure rates -and such things do happen, causing IC users to be constantly on the watch.

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Section: Figure 1 the Bathtub Curvementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Reliability Trends of New ICs Generations

Titu-Marius¹

2020

EEA

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“…TDR uses a pulse generator and a high-speed oscilloscope to record in real time the reflection of a microwave signal by the open barrier [3,4]. TDR can at best provide resolution of about 1 mm making it most suitable for the high-pincount packages, such as quad flat package and ball grid array, but less convenient for smaller packages (less than 1 cm 2 ) [5], and more or less impossible to use on the latest development for connecting dies in wafer leveling packaging using microbumps. An extension of the TDR technique employs a Vector Network Analyzer (VNA) to obtain the device response in the frequency domain by applying a continuous wave and then measuring the reflected wave.…”

Section: Time Domain Reflectometrymentioning

confidence: 99%

Space Domain Reflectometry for opens detection location in microbumps

Gaudestad

Talanov

Huang

2012

Microelectronics Reliability

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“…These reflections can correspond to capacitive, inductive, or resistive distortion of the PUT impedance. The resulting waveform is the combination of the incident step and reflections generated when the step encounters impedance deviations from 50 Ω [7].…”

Section: A Parasitics Extraction Using Tdrmentioning

confidence: 99%

CDM Simulation Based on Tester, Package and Full Integrated Circuit Modeling: Case Study

Abessolo-Bidzo

Smedes

Huitsing

2012

IEEE Trans. Electron Devices

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The electrostatic discharge (ESD) sensitivity of ICs with respect to the charged-device model (CDM) is strongly dependent on the IC package, the substrate resistivity, and the effectiveness of the ESD protection network. This paper presents a case study of predictive CDM circuit simulation method based on the tester, package, and full IC modeling approach. Index Terms-Bipolar and complementary metal oxide semiconductor (BiCMOS) integrated circuits (ICs), electrostatic discharge (ESD), SPICE simulations.

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Isolating failing sites in IC packages using time domain reflectometry: Case studies

Cited by 11 publications

References 1 publication

Reliability Trends of New ICs Generations

Reliability Trends of New ICs Generations

Space Domain Reflectometry for opens detection location in microbumps

CDM Simulation Based on Tester, Package and Full Integrated Circuit Modeling: Case Study

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