“…This ion bombardment causes sputtering of the target, and the sputtered alloy atoms move toward the surface of the workpiece under the action of the electric field, magnetic field, and gravity, resulting in the formation of coatings. Moreover, DGPSA is carried out at high temperatures, and the atoms between the coating and matrix diffuse mutually, resulting in metallurgical bonding between the coating and the substrate and thereby improving the adhesion of the coating [10]. Compared with thermal spraying, magnetron sputtering, chemical vapor deposition (CVD), and physical vapor deposition (PVD), DGPSA has the advantages of controllable thickness, strong bonding force, and few defects such as voids and cracks [12][13][14].…”