Untitled

Abstract

layer between metal and semiconductor. Such insulating layer alters barrier height, leakage current, series resistance, interface states and device capacitance. Moreover, it helps passivation of dangling bonds, prevents interdiffusion between metal and semiconductor and alleviates electric field reduction (Gökçen et al. 2011, Çetinkaya et al. 2015). For the last couple decade, researchers try various insulating materials both organic and inorganic in order to obtain optimized device characteristics (