“…or their combination), 14–16 reaction joining using Ti and Mo foils forming titanium and molybdenum silicides in the bonding layer, 17,18 and reaction bonding via silicon infiltration in the carbon interlayer forming SiC with residual Si in the bonding layer 19,20 . The application of metallic filler joining is limited to low‐temperature structural applications due to its poor high‐temperature strength and oxidation resistance and poor irradiation tolerance 14,21,22 . The nonmetallic filler joining technique includes polymer‐derived ceramic joining, 23,24 transient eutectic‐phase joining using SiC‐based mixed oxide additives, 14,25,26 and glass‐ceramic joining 27–44 .…”