Josephson Bicrystal Junctions on Sapphire Substrates for THz Frequency Application

Ovsyannikov, G. A.; Borisenko, I. V.; Constantinian, K. Y.; Kislinski, Y.V.; Hakhoumian, A.A.; Pogosyan, N.G.; Zakaryan, T.V.

doi:10.1007/s10948-006-0130-6

Cited by 3 publications

(4 citation statements)

References 13 publications

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“…Leading technological developments during the last decades relate to advanced materials, which are concerned with deposition of thin films over substrates through employment of techniques, such as epitaxy, chemical vapor deposition (CVD) and physical vapor deposition (PVD) [1]. Bicrystals made of orthorhombic/cubic crystalline phases are common occurrences in many modern advanced technological applications, such as sensors [2], semiconductors [3], superconductivity [4] and so on. For example, gold nanocrystal superlattices can be formed on silicon nitride substrates with long range ordering over several microns [2].…”

Section: Introductionmentioning

confidence: 99%

“…For example, gold nanocrystal superlattices can be formed on silicon nitride substrates with long range ordering over several microns [2]. Pashley et al [3] have reported preparation of monocrystalline films of gold and silver onto molybdenum disulfide inside an electron microscope that permits direct observation of the mode of growth. Although considered to be non-conventional for microelectronics, grain boundary junction engineering is frequently employed in metal oxide superconductor (MOS) THz frequency applications [4].…”

Section: Introductionmentioning

confidence: 99%

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Three-Dimensional Singular Stress Fields and Interfacial Crack Path Instability in Bicrystalline Superlattices of Orthorhombic/Tetragonal Symmetries

Chaudhuri

2024

Preprint

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First, a recently developed eigenfunction expansion technique, based in part on separation of the thickness-variable and partly utilizing a modified Frobenius type series expansion technique in conjunction with the Eshelby-Stroh formalism, is employed to derive three-dimensional singular stress fields in the vicinity of the front of an interfacial crack weakening an infinite bicrystalline superlattice plate, made of orthorhombic (cubic, hexagonal and tetragonal serving as special cases) phases, of finite thickness and subjected to the far-field extension/bending, in-plane shear/twisting and anti-plane shear loadings, distributed through the thickness. Crack-face boundary and interface contact conditions as well as those that are prescribed on the top and bottom surfaces of the bicrystalline superlattice plate are exactly satisfied. It also extends a recently developed concept of lattice crack deflection (LCD) barrier to a superlattice, christened superlattice crack deflection (SCD) energy barrier for studying interfacial crack path instability, which can explain crack deflection from a difficult interface to an easier neighboring cleavage system. Additionally, the relationships of the nature (easy/easy, easy/difficult or difficult/difficult) interfacial cleavage systems based on the present solutions with the structural chemistry aspects of the component phases (such as orthorhombic, tetragonal, hexagonal as well as FCC (face centered cubic) transition metals and perovskites) of the superlattice are also investigated. Finally, results pertaining to the through-thickness variations of mode I/II/III stress intensity factors and energy release rates for symmetric hyperbolic sine distributed load and their skew-symmetric counterparts that also satisfy the boundary conditions on the top and bottom surfaces of the bicrystalline superlattice plate under investigation, also form an important part of the present investigation.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Three-Dimensional Singular Stress Fields and Interfacial Crack Path Instability in Bicrystalline Superlattices of Orthorhombic/Tetragonal Symmetries

Chaudhuri

2024

Preprint

View full text Add to dashboard Cite

show abstract

“…Leading technological developments during the last decades relate to advanced materials, which are concerned with the deposition of thin films over substrates through the employment of techniques such as epitaxy, chemical vapor deposition (CVD), and physical vapor deposition (PVD) [1]. Bicrystals made of orthorhombic/cubic crystalline phases are common occurrences in many modern advanced technological applications, such as sensors [2], semiconductors [3], superconductivity [4], and so on. For example, gold nanocrystal superlattices can be formed on silicon nitride substrates with long-range ordering over several microns [2].…”

Section: Introductionmentioning

confidence: 99%

“…For example, gold nanocrystal superlattices can be formed on silicon nitride substrates with long-range ordering over several microns [2]. Pashley et al [3] have reported the preparation of mono-crystalline films of gold and silver onto molybdenum disulfide inside an electron microscope that permits the direct observation of the mode of growth [1]. Although considered to be non-conventional for microelectronics, grain boundary junction engineering is frequently employed in metal oxide superconductor (MOS) THz frequency applications [4].…”

Section: Introductionmentioning

confidence: 99%

Three-Dimensional Singular Stress Fields and Interfacial Crack Path Instability in Bicrystalline Superlattices of Orthorhombic/Tetragonal Symmetries

Chaudhuri

2024

Crystals

View full text Add to dashboard Cite

First, a recently developed eigenfunction expansion technique, based in part on the separation of the thickness variable and partly utilizing a modified Frobenius-type series expansion technique in conjunction with the Eshelby–Stroh formalism, is employed to derive three-dimensional singular stress fields in the vicinity of the front of an interfacial crack weakening an infinite bicrystalline superlattice plate, made of orthorhombic (cubic, hexagonal, and tetragonal serving as special cases) phases of finite thickness and subjected to the far-field extension/bending, in-plane shear/twisting, and anti-plane shear loadings, distributed through the thickness. Crack-face boundary and interface contact conditions as well as those that are prescribed on the top and bottom surfaces of the bicrystalline superlattice plate are exactly satisfied. It also extends a recently developed concept of the lattice crack deflection (LCD) barrier to a superlattice, christened superlattice crack deflection (SCD) energy barrier for studying interfacial crack path instability, which can explain crack deflection from a difficult interface to an easier neighboring cleavage system. Additionally, the relationships of the nature (easy/easy, easy/difficult, or difficult/difficult) interfacial cleavage systems based on the present solutions with the structural chemistry aspects of the component phases (such as orthorhombic, tetragonal, hexagonal, as well as FCC (face-centered cubic) transition metals and perovskites) of the superlattice are also investigated. Finally, results pertaining to the through-thickness variations in mode I/II/III stress intensity factors and energy release rates for symmetric hyperbolic sine-distributed loads and their skew-symmetric counterparts that also satisfy the boundary conditions on the top and bottom surfaces of the bicrystalline superlattice plate under investigation also form an important part of the present investigation.

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Terahertz Intrinsic and Effective Surface Impedances of High-Temperature Superconducting Thin Films

Lin

Yang

et al. 2010

Journal of Electromagnetic Waves and Applications

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Josephson Bicrystal Junctions on Sapphire Substrates for THz Frequency Application

Cited by 3 publications

References 13 publications

Three-Dimensional Singular Stress Fields and Interfacial Crack Path Instability in Bicrystalline Superlattices of Orthorhombic/Tetragonal Symmetries

Three-Dimensional Singular Stress Fields and Interfacial Crack Path Instability in Bicrystalline Superlattices of Orthorhombic/Tetragonal Symmetries

Three-Dimensional Singular Stress Fields and Interfacial Crack Path Instability in Bicrystalline Superlattices of Orthorhombic/Tetragonal Symmetries

Terahertz Intrinsic and Effective Surface Impedances of High-Temperature Superconducting Thin Films

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