2018
DOI: 10.17576/jsm-2018-4707-29
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Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma

Abstract: Kesan tiubnano karbon (CNT) terhadap pertumbuhan lapisan sebatian antara logam (IMC) bagi sistem pateri bebas plumbum 96.5Sn-3.0Ag-0.5Cu/substrat Cu telah dikaji. Serbuk aloi SnAg -Cu (SAC305) dicampurkan dengan 0.02 peratus berat CNT untuk menghasilkan pes pateri SAC305-CNT. Kedua-dua pes pateri SAC305 dan SAC305-CNT dicetak secara manual di atas permukaan papan litar bercetak (PCB) dengan kemasan kuprum (Cu) menggunakan kaedah percetakan stensil. Sampel yang telah dicetak dikenakan proses pematerian aliran s… Show more

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Cited by 9 publications
(5 citation statements)
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“…The results show that increasing temperature caused negative properties of hardness of SAC305 solder wire. This situation occur due to softening effect, which enable indenter tip to penetrate the sample structure from the surface more easier [8,9,19,20]. However, thermomechanical-processed samples produced a different trend from control sample.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The results show that increasing temperature caused negative properties of hardness of SAC305 solder wire. This situation occur due to softening effect, which enable indenter tip to penetrate the sample structure from the surface more easier [8,9,19,20]. However, thermomechanical-processed samples produced a different trend from control sample.…”
Section: Resultsmentioning
confidence: 99%
“…These values are inverse with their hardness values that increase along the temperature increment as shown in Figure 4. This is because softening occurs as a result of microstructural changes, which are impacted by thermodynamic activities such as temperature (19). In comparison to hardness, the reduced modulus of Sn-0.7Cu solder alloy shows various fluctuations with increasing temperature and thickness reduction, as illustrated in Figure 6.…”
Section: Resultsmentioning
confidence: 99%
“…The decreased in hardness values occurred due to the easy penetration of indenter tip into the structure of sample when load is applied and vice versa. This is due to the occurrence of softening caused by microstructural changes due to thermally activated process such as temperature [14].…”
Section: Maximum Depthmentioning
confidence: 99%
“…Daripada Rajah 3(a) dan 3(b), mikrostruktur sambungan pateri SAC305 dan SAC305-CNT menunjukkan fasa-fasa umum yang terbentuk seperti fasa B-Sn, fasa eutektik dan sebatian antara logam (IMC) Cu 6 Sn 5 selepas pematerian (Pietrikova & Durisin 2010). Pendedahan sambungan pateri SAC305 terhadap suhu menggalakan aktiviti resapan unsur-unsur logam matriks bahan pateri (Ismail et al 2018). Pendedahan yang berpanjangan menyebabkan berlakunya pengasaran fasa yang terlibat seperti yang berlaku pada mikrostruktur sambungan pateri SAC305 dan SAC305-CNT selepas penuaan terma (Rajah 3(c) dan 3(d).…”
Section: Keputusan Dan Perbincanganunclassified