Kinematical Modeling of Pad Profile Variation during Conditioning in Chemical Mechanical Polishing

Lee, Sangjik; Jeong, Sukhoon; Park, Ki Hyun; Kim, Hyoungjae; Jeong, Haedo

doi:10.1143/jjap.48.126502

Cited by 16 publications

(16 citation statements)

References 9 publications

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“…Many researchers have used kinematic analysis to investigate the conditioning process [5][6][7][8]. However, almost all the above research studies are about the soft pad, not the fixed abrasive pad.…”

Section: Literature Reviewmentioning

confidence: 99%

Analysis and improvement of the pad wear profile in fixed abrasive polishing

Nguyen

Zhong

Tian

2015

Int J Adv Manuf Technol

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Fixed abrasive polishing has some advantages in generating good planarization surfaces with low defects. The surfaces after polishing have better uniformity, and the material removal rate is much higher than that of the traditional chemical mechanical polishing using loose abrasives. One of the most important factors that have significant effects on the uniformity of the polished surface is the pad wear profile. The pad wear profile after a long time of polishing is almost concave, and it has been challenging to create a flat surface. Therefore, there is a requirement for creating a better pad wear profile to improve quality of machined surfaces in chemical-mechanical polishing processes. In this paper, kinematic aspects of the effects of operation parameters on the pad wear profile are investigated, combining with conditioner sizes, pattern, and positions. Based on that, a new model, including new designs of the conditioner and pad, is proposed. This new model has created a convex pad wear profile instead of a concave one. According to the result of the new model, the pad shape after the conditioning process is more uniform than the old one conditioned by the old model. The result was validated by an algorithm which was validated by the experiments reported in our previous paper.

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Section: Literature Reviewmentioning

confidence: 99%

Analysis and improvement of the pad wear profile in fixed abrasive polishing

Nguyen

Zhong

Tian

2015

Int J Adv Manuf Technol

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“…They explained that the difference between experimental result and simulation may come from the moment that the friction forces act on the conditioner disk. Lee et al [35] simulated swing-arm CMP conditioning via kinematic modeling and showed that the swing-arm velocity profile (SAVP) affected the pad profile. They calculated the pad wear profile by drawing a virtual concentric circle on the surface of the pad and summing the sliding distance of the conditioner's diamond grits passing through the virtual area.…”

Section: Introductionmentioning

confidence: 99%

Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime

Son

Lee

2021

Applied Sciences

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Chemical–mechanical polishing (CMP) is a process that planarizes semiconductor surfaces and is essential for the manufacture of highly integrated devices. In CMP, pad conditioning using a disk with diamond grit is adopted to maintain the surface roughness of the polishing pad and remove polishing debris. However, uneven pad wear by conditioning is unavoidable in CMP. In this study, we propose a contact-area-changeable conditioning system and utilize it to conduct a preliminary study for improving pad lifetime. Using the conventional conditioning method (Case I), the material removal rate (MRR) decreased rapidly after 12 h of conditioning and the within-wafer non-uniformity (WIWNU) increased. However, the results of conditioning experiments show that when using a contact-area-changeable conditioning system, uniform pad wear can be obtained in the wafer–pad contact area and the pad lifetime can be extended to more than 20 h. Finally, the newly proposed conditioning system in this study may improve the CMP pad lifetime.

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“…The pad wear rate is affected by many factors [28,29] [103] have studied a kinematical model of motions of the conditioner in the CMP process; however, the conditioner in their research is handled by a swing arm, not an oscillation motion in the radial direction. Chang et al [101] have also proposed a mathematical model based on a kinematic motion but they assumed that "the oscillation velocity is neglected".…”

Section: Pad Wear Profilementioning

confidence: 99%

“…In CMP processes, pad wear has an important effect on the uniformity of wafer substrates. If the pad wear is not uniform, the cutting effect of the pad on the wafer surface is also not uniform [28,103]. The pad is almost concave which results in the non-uniformity of polished surfaces.…”

Section: Improvement Of the Non-uniformitymentioning

confidence: 99%

“…It refreshes the slurry on the pad surface, therefore, the chemical reaction happens more evenly and continually, and the non-uniformity is improved.Some researchers have shown that the concavity of the polishing pad increased with conditioning time[101,102]. Many researchers have used kinematic analysis to investigate the conditioning process[103][104][105][106]. Some other researchers have investigated the CMP process based on the kinematic of the cutting motion…”

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Computational analysis and chemical mechanical polishing for manufacturing of optical components

Nguyen¹

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Kinematical Modeling of Pad Profile Variation during Conditioning in Chemical Mechanical Polishing

Cited by 16 publications

References 9 publications

Analysis and improvement of the pad wear profile in fixed abrasive polishing

Analysis and improvement of the pad wear profile in fixed abrasive polishing

Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime

Computational analysis and chemical mechanical polishing for manufacturing of optical components

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