2015
DOI: 10.1007/s00170-015-8025-y
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Analysis and improvement of the pad wear profile in fixed abrasive polishing

Abstract: Fixed abrasive polishing has some advantages in generating good planarization surfaces with low defects. The surfaces after polishing have better uniformity, and the material removal rate is much higher than that of the traditional chemical mechanical polishing using loose abrasives. One of the most important factors that have significant effects on the uniformity of the polished surface is the pad wear profile. The pad wear profile after a long time of polishing is almost concave, and it has been challenging … Show more

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Cited by 11 publications
(5 citation statements)
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“…The standard sample, with volume ratios of SiC abrasive particles 20%, 35%, and 50% respectively, was selected to form two groups of double-layer standard samples, which were also used for experimental verification. The Young's modulus of each group and the corresponding equivalent Young's modulus calculated by Equation (4) are given in Table 6. In addition, the stress detection system is used, which consists of a JLBS-M2 pressure sensor (0.1% FS) and an MCK-Z-I intelligent display controller.…”
Section: Experimental Preparationmentioning
confidence: 99%
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“…The standard sample, with volume ratios of SiC abrasive particles 20%, 35%, and 50% respectively, was selected to form two groups of double-layer standard samples, which were also used for experimental verification. The Young's modulus of each group and the corresponding equivalent Young's modulus calculated by Equation (4) are given in Table 6. In addition, the stress detection system is used, which consists of a JLBS-M2 pressure sensor (0.1% FS) and an MCK-Z-I intelligent display controller.…”
Section: Experimental Preparationmentioning
confidence: 99%
“…Material removal uniformity during lapping and polishing process has been a focus of research for years owing to its significant effects on processing efficiency and surface quality. [1][2][3][4][5][6][7] Preston equation (material removal rate [MRR] = KPV) has a wide range of applications in material processing, [8][9][10] where P is the contact stress, V is the relative velocity, and K is a coefficient related to the processing parameters. In terms of Preston equation, the non-uniformity of the distribution of P and V is the important source for the nonuniformity of MRR.…”
Section: Introductionmentioning
confidence: 99%
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“…On the contrary, the fixed abrasive polishing (FAP) process has a higher material removal efficiency than the free abrasive polishing process [19][20][21]. Therefore, it can be used to polish hard brittle materials, such as silicon wafers, glass, and ceramics [22][23][24].…”
Section: Introductionmentioning
confidence: 99%
“…However, little research has dealt with the variation of the pad characteristics due to pad wear [4]. One of the most important factors that have significant effects on the uniformity of the polished surface is the pad wear profile [5]. Non-uniformity of pad surface topography affects the contact area and friction force between the pad and wafer surface [6].…”
Section: Introductionmentioning
confidence: 99%