Kinetic and hydrodynamic implications of 1-D and 2-D models for copper electrodeposition under mixed kinetic-mass transfer control

Vazquez‐Arenas, Jorge; Pritzker, Mark; Fowler, Michael

doi:10.1016/j.electacta.2012.11.024

Cited by 5 publications

(2 citation statements)

References 23 publications

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“…The Cu 2+ concentration in the bulk is assumed to be 1 mol dm −3 to ensure that deposition remains in the kinetically-controlled regime for all current densities applied in the simulations. At this bulk concentration, the highest current density of −1000 A m −2 considered is less than 20% of the limiting current density for copper deposition onto a disk electrode rotating at 1000 RPM, as estimated using the Levich equation [43,44]:…”

Section: Resultsmentioning

confidence: 99%

Kinetic Monte Carlo simulation of electrodeposition using the embedded-atom method

Treeratanaphitak

Pritzker

Abukhdeir

2014

Electrochimica Acta

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A kinetic Monte Carlo (KMC) method for deposition is presented and applied to the simulation of electrodeposition of a metal on a single crystal surface of the same metal under galvanostatic conditions. This method utilizes the multi-body embedded-atom method (EAM) potential to characterize the interactions of metal atoms and adatoms. The method accounts for collective surface diffusion processes, in addition to nearest-neighbor hopping, including atom exchange and step-edge atom exchange. Steady-state deposition configurations obtained using the KMC method are validated by comparison with the structures obtained through the use of molecular dynamics (MD) simulations to relax KMC constraints. The results of this work support the use of the proposed KMC method to simulate electrodeposition processes at length (microns) and time (seconds) scales that are not feasible using other methods.

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Section: Resultsmentioning

confidence: 99%

Kinetic Monte Carlo simulation of electrodeposition using the embedded-atom method

Treeratanaphitak

Pritzker

Abukhdeir

2014

Electrochimica Acta

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“…There are many successful modeling studies reported in recent years with COMSOL [17,18]. However, there are few COMSOL modeling studies for electrodeposition of coatings [19,20]. In this novel study, we successfully used Zview and COMSOL Multiphysics 5.0 together to model EIS results of electrodeposited hydroxyapatite coated CoCrMo bio-metallic implants.…”

Section: Introductionmentioning

confidence: 90%

Computer assisted corrosion analysis of hydroxyapatite coated CoCrMo biomedical alloys

Coşkun

Karahan

Golden

2015

Surface and Coatings Technology

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Multiphysics coupling simulation of RDE for PCB manufacturing

Wang

et al. 2015

Circuit World

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Purpose -The purpose of this paper is to optimize experimental parameters and gain further insights into the plating process in the fabrication of high-density interconnections of printed circuit boards (PCBs) by the rotating disc electrode (RDE) model. Via metallization by copper electrodeposition for interconnection of PCBs has become increasingly important. In this metallization technique, copper is directly filled into the vias using special additives. To investigate electrochemical reaction mechanisms of electrodeposition in aqueous solutions, using experiments on an RDE is common practice. Design/methodology/approach -An electrochemical model is presented to describe the kinetics of copper electrodeposition on an RDE, which builds a bridge between the theoretical and experimental study for non-uniform copper electrodeposition in PCB manufacturing. Comsol Multiphysics, a multiphysics simulation platform, is invited to modeling flow field and potential distribution based on a two-dimensional (2D) axisymmetric physical modeling. The flow pattern in the electrolyte is determined by the 2D Navier-Stokes equations. Primary, secondary and tertiary current distributions are performed by the finite element method of multiphysics coupling. Findings -The ion concentration gradient near the cathode and the thickness of the diffusion layer under different rotating velocities are achieved by the finite element method of multiphysics coupling. The calculated concentration and boundary layer thicknesses agree well with those from the theoretical Levich equation. The effect of fluid flow on the current distribution over the electrode surface is also investigated in this model. The results reveal the impact of flow parameters on the current density distribution and thickness of plating layer, which are most concerned in the production of PCBs. Originality/value -By RDE electrochemical model, we build a bridge between the theoretical and experimental study for control of uniformity of plating layer by concentration boundary layer in PCB manufacturing. By means of a multiphysics coupling platform, we can accurately analyze and forecast the characteristic of the entire electrochemical system. These results reveal theoretical connections of current density distribution and plating thickness, with controlled parameters in the plating process to further help us comprehensively understand the mechanism of copper electrodeposition.

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Kinetic and hydrodynamic implications of 1-D and 2-D models for copper electrodeposition under mixed kinetic-mass transfer control

Cited by 5 publications

References 23 publications

Kinetic Monte Carlo simulation of electrodeposition using the embedded-atom method

Kinetic Monte Carlo simulation of electrodeposition using the embedded-atom method

Computer assisted corrosion analysis of hydroxyapatite coated CoCrMo biomedical alloys

Multiphysics coupling simulation of RDE for PCB manufacturing

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