Kinetic studies of an epoxy cure reaction by isothermal DSC analysis

Lee, J.Y; Choi, H.K.; Shim, Mi-Ja; Kim, S.W

doi:10.1016/s0040-6031(99)00303-2

Cited by 72 publications

(30 citation statements)

References 12 publications

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“…The most well-known and most frequently applied model for epoxy reaction kinetics is the Kamal's autocatalytic model. 9,10,27 However, Montserrat and Málek 11 have indicated that the curing reaction kinetics of a DGEBA cured with both a hardener derived from a methyl tetrahydrophthalic anhydride and a tertiary amine as accelerator is described more accurately by the two-parameter autocatalytic model of Sesták-Berggren:…”

Section: Curing Kinetics Modelingmentioning

confidence: 99%

“…Its reaction kinetics must be measured and modeled over time and temperature. Curing kinetics of epoxy systems already have been studied extensively, giving rise to several curing kinetics models, especially with amine-cured epoxy systems 4,5,8,9 and, to a lower extent, with anhydride-cured epoxy systems. 10,11 Most of the models proposed so far depend only on the type of reaction involved (e.g., nth-order reaction or autocatalytic reaction).…”

Section: Introductionmentioning

confidence: 99%

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TTT‐cure diagram of an anhydride‐cured epoxy system including gelation, vitrification, curing kinetics model, and monitoring of the glass transition temperature

Teil

Page

Michaud

et al. 2004

J of Applied Polymer Sci

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ABSTRACT:The curing reaction of an epoxy resin [diglycidyl ether of bisphenol A (DGEBA)] combined with a methyl-hexahydrophtalic anhydride (MHHPA) hardener and a benzyldimethylamine (BDMA) accelerator was studied over a temperature range of 60 -140°C to build its isothermal time-temperature-transformation (TTT)-cure diagram. This includes gelation and vitrification measurements using rheological measurement techniques, monitoring of the glass transition temperature and the reaction kinetics by differential scanning calorimetry, and determination of the following critical glass transition temperatures: T g0 , Gel T g , and T gϱ . A new curing kinetics model, based on the Sesták-Berggren model, was developed including both chemicaland diffusion-controlled stages of reaction. Then, the TTTcure diagram was built by numerical integration of the kinetics model, and good agreement was obtained by comparison with experimental data. Additionally, for the first time, this model takes into account the incomplete cure, which occurs when the thermosetting system is cured below its ultimate glass transition temperature, leading to a more realistic description of the cure evolution after vitrification.

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Section: Curing Kinetics Modelingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

TTT‐cure diagram of an anhydride‐cured epoxy system including gelation, vitrification, curing kinetics model, and monitoring of the glass transition temperature

Teil

Page

Michaud

et al. 2004

J of Applied Polymer Sci

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show abstract

“…These resins have good thermal, electrical and mechanical properties, but they are brittle and have poor resistance to crack propagation [1][2][3][4]. The chemical formulation of epoxy resin is given in Fig.…”

Section: Introductionmentioning

confidence: 99%

“…DSC is one of the best-known methods and is mainly divided into two categories, namely isothermal and dynamic scanning [2,4,7]. In dynamic scanning, the sample is heated at a constant rate and the rate of energy release monitored as a function of time.…”

Section: Introductionmentioning

confidence: 99%

Cure kinetics of epoxy resin-natural zeolite composites

Erdoğan

Seyhan

Ocak

et al. 2008

J Therm Anal Calorim

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The cure kinetics of epoxy resin and epoxy resin containing 10 mass% of natural zeolite were investigated using differential scanning calorimetry (DSC). The conformity of the cure kinetic data of epoxy and epoxy-zeolite system was checked with the autocatalytic cure rate model. The results indicated that the hydroxyl group on the zeolite surface played a significant role in the autocatalytic reaction mechanism. This group was able to form a new transition state between anhydride hardener and epoxide group. The natural zeolite particles acted as catalyst for the epoxy system by promoting its curing rate.

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“…The least square best fit method can be used to minimise this difference between the calculated and measured values by altering the values of K 1 , K 2 , m and n. This produces 'fitted' values of K 1 , K 2 , m and n for all temperatures which can be used to find the cure kinetics of each model. Arrhenius found that by taking the natural logarithm (ln) of both K 1 and K 2 and plotting them in a graph against the inverse of temperature (1/T) two linear correlations are produced, with gradient and intercept of (-E/R) and A respectively [15]:…”

Section: Cure Kinetics Evaluation By Dscmentioning

confidence: 99%

Experimental validation of a thermal model of adhesively bonded scarf repairs for CFRP composite materials incorporating cure kinetics

Bestley¹,

Brown²,

Alston³

2011

Materials Characterisation V

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Adhesively bonded scarf repairs are the preferred method of repairing modern composite structures as they provide high strength restoration and aerodynamic flushness. Curing of the adhesive bondline is carried out by locally heating the repair area. To assess repair design and heating practices simulation can be used to model both the transient heat transfer during curing and the level of cure likely to be achieved at different regions in the adhesive joint. In this paper a 3D curing model is described to simulate heat transfer through a composite component. The cure kinetics of a commercial epoxy resin adhesive have been determined using isothermal Differential Scanning Calorimetric (DSC) analysis. Using these kinetics the model is able to determine the influence of the exothermic reaction within the adhesive on the overall temperature variation within the component. An experimental programme has been carried out where composite material and bonded repair patches have been cured with thermocouples providing measured temperature/time data during the cycle. The results from the cure model are then validated by comparison with these experimental results. The cure model is capable of being used to optimise the cure cycle for a bonded repair, ensuring the maximum degree of cure of the adhesive with minimum variation of temperature within the bond line.

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Kinetic studies of an epoxy cure reaction by isothermal DSC analysis

Cited by 72 publications

References 12 publications

TTT‐cure diagram of an anhydride‐cured epoxy system including gelation, vitrification, curing kinetics model, and monitoring of the glass transition temperature

TTT‐cure diagram of an anhydride‐cured epoxy system including gelation, vitrification, curing kinetics model, and monitoring of the glass transition temperature

Cure kinetics of epoxy resin-natural zeolite composites

Experimental validation of a thermal model of adhesively bonded scarf repairs for CFRP composite materials incorporating cure kinetics

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