Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid–Liquid Interdiffusion (SLID) Bonding

Rodriguez, R.I.; Ibitayo, Dimeji; Quintero, Pedro O.

doi:10.1007/s11664-013-2614-z

Cited by 8 publications

(4 citation statements)

References 11 publications

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“…Due to this premature alloying of Sn, the liquid layer is typically made up of Au 0.8 Sn 0.2 eutectic instead of elemental Sn; therefore, bonding temperatures need to be 280 °C–350 °C to ensure that a liquid layer is formed as the alloy composition passes through the eutectic composition. Several publications describe the kinetics of this process [134,135,136,137]. …”

Section: Bonding Approachesmentioning

confidence: 99%

Wafer-Level Vacuum Packaging of Smart Sensors

Hilton

Temple

2016

Sensors

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The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

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Section: Bonding Approachesmentioning

confidence: 99%

Wafer-Level Vacuum Packaging of Smart Sensors

Hilton

Temple

2016

Sensors

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“…Due to their low thermal stability, conventional solders cannot be used in manufacturing for high-temperature applications, such as chip stacking, multi-chip assembly or 3D integration (Lee and Wang, 1993; Eagar and Hoh, 1992; Bernstein, 1966; Bartels et al , 1994; Tollefsen et al , 2012; Rodriguez et al , 2013; Lee et al , 2015; Huebner et al , 2006; Klumpp et al , 2004; Lapadatu et al , 2010; Jung et al , 2018; Natzke and Grossner, 2017). Likewise, the use of high-temperature bonding technologies may result in irreparable damage to devices, as it causes a mismatch of the coefficient of thermal expansion among the different layers, and this triggers high thermodynamic stress (Tollefsen et al , 2012; Rodriguez et al , 2013; Lee et al , 2015).…”

Section: Introductionmentioning

confidence: 99%

Transient liquid phase bonding in the Cu-Sn system

Hosseinzaei

Rashid

2019

SSMT

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Purpose This paper aims to study the features of microstructures and mechanical properties of the joints which were produced by transient liquid phase method. The difference between phases in bonding region identified through metallography pictures and applying hardness and shear strength tests. Design/methodology/approach The bonding process was carried out at a temperature of 300°C for time durations ranging from 15 to 120 min. The scanning electron microscopy equipped with energy dispersive spectroscopy system and optical microscopy were used to examine microstructural characteristics, and mechanical properties of the joints were studied by applying microhardness and shear tests. The shear tests were conducted by a shear fixture which was mounted on the tensile machine. Findings The intermetallic compounds of the Cu6Sn5 −η and the Cu3Sn-ε were formed simultaneously in the bonding interface. Although the η-phase, which exhibits scallop-shaped morphology, grows very quickly, upon completion of the isothermal solidification stage, it turns into the ε-phase. The hardness of the bonding interface is significantly higher than that of the substrate. The shear results show that once the bonding process is complete, brittle fracture occurs. Moreover, a greater decrease in strength was observed when the ε-phase is the only phase in the bonding region. Originality/value The hardness number of the η-phase is higher than that of the ε-phase. The hardness numbers of the η-phase and the ε-phase are 894 and 689 HV, respectively. The mean shear strength values of the samples that were bonded at 300 °C for 15, 60 and 120 min were 11.7, 9.5 and 5.4 MPa, respectively.

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“…Pb-free intermetallic-based solder joint for Au-In using isothermal solidification technique was studied by Wang et al (2000). Rodriguez et al (2013) studied isothermal solidification for gold-enriched SLID bonding technique. Researchers have been working on Pb-free-based stable interconnection for various solder alloys, such as Bi-rich alloys (Takaku et al , 2006) and Pb-free composite solders with indium solder thin-films (Chen et al , 2006).…”

Section: Introductionmentioning

confidence: 99%

Stable interconnections for LTCC micro-heater using isothermal solidification technique

Kumar

Suri

Khanna

2018

SSMT

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Purpose The purpose of this work is to explore the forms of intermetallic phase compounds (IMPCs) in Pt/In/Au and Pt/In/Ag joints by using isothermal solidification. This lead-free technique leads to formation of IMPCs having high-temperature stable joints for platinum-based micro-heater gas sensor fabricated on low temperature co-fired ceramic (LTCC) substrate. Design/methodology/approach Proposed task is to make an interconnection for Pt micro-heater electrode pad to the silver and gold thick-films printed on LTCC substrate. Both Pt/In/Au and Pt/In/Ag configured joints with different interactive areas prepared at 190 and 220°C to study temperature and contact surface area effects on ultimate tensile strength of the joints, for a 20 s reaction time, at 0.2 MPa applied pressure. Those delaminated joint interfaces studied under SEM, EDAX and XRD. Findings IMPCs identified through material analysis using diffraction analysis of XRD data are InPt3, AgIn2, AgPt, AgPt3, Au9In4 and other stoichiometric compounds. The interactive surface area between thick-films and temperature increment shows improvement in the formations of IMPCs and mechanical stability of joints. These IMPCs-based joints have improved the mechanical stability to the joints to sustain even at high operating temperatures. Elemental mapping of the weak joint contact interface shows unwanted oxide formations also reported. Physical inter-locking followed by the diffusion phenomenon on the silver substrate strengthen the interconnection has been noticed. Research limitations/implications Inert gas environment creation inside the chamber to isolate the lead-free joint placed between heating stamp pads to avoid oxide formations at the interface while cooling which adds up to the cost of manufacturing. Most of the oxides at a joint-interface increase minute to moderate resistance with respect to the level of oxides took place. These oxides contributed heat certainly damage the micro-heater based gas sensors while functioning. Practical implications These isothermal solidification-based lead-free solder joints formation replace the existing lead-based packaging techniques. These lead-free interconnections on ceramic or LTCC substrate are reliable and durable, especially those designed to work for heavy-duty engines, even at severe environment conditions. Originality/value Platinum micro-heater-based gas sensors handles over a wide-range of temperatures about 300 to 500°C. The specific temperature level of different oxide films (SnO2) on the micro-heater is capable of detecting various specific gases. This feature of platinum based gas sensor demands durable and mechanically stable joints for continuous monitoring.

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Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid–Liquid Interdiffusion (SLID) Bonding

Cited by 8 publications

References 11 publications

Wafer-Level Vacuum Packaging of Smart Sensors

Wafer-Level Vacuum Packaging of Smart Sensors

Transient liquid phase bonding in the Cu-Sn system

Stable interconnections for LTCC micro-heater using isothermal solidification technique

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