Advancement in high-performance photonics/electronics
devices has
boosted generated thermal energy, making thermal management a bottleneck
for accelerated innovation in these disciplines. Although various
methods have been used to tackle the thermal management problem, evaporation
with nanometer fluid thickness is one of the most promising approaches
for future technological demands. Here, we studied thin-film evaporation
in nanochannels under absolute negative pressure in both transient
and steady-state conditions. We demonstrated that thin-film evaporation
in nanochannels can be a bubble-free process even at temperatures
higher than boiling temperature, providing high reliability in thermal
management systems. To achieve this bubble-free characteristic, the
dimension of nanochannels should be smaller than the critical nucleolus
dimension. In transient evaporative conditions, there is a plateau
in the velocity of liquid in the nanochannels, which limits the evaporative
heat flux. This limit is imposed by liquid viscous dissipation in
the moving evaporative meniscus. In contrast, in steady-state condition,
unprecedented average interfacial heat flux of 11 ± 2 kW cm–2 is achieved in the nanochannels, which corresponds
to liquid velocity of 0.204 m s–1. This ultrahigh
heat flux is demonstrated for a long period of time. The vapor outward
transport from the interface is both advective and diffusion controlled.
The momentum transport of liquid to the interface is the limiting
physics of evaporation at steady state. The developed concept and
platform provide a rational route to design thermal management technologies
for high-performance electronic systems.