coating and aerosol printing. [3][4][5][6][7][8] Various printed transparent bottom electrodes, such as conducting polymers, [9,10] metal nanowires, [11,12] carbon nanotubes, [13] and graphene, [14] have also been demonstrated with performances approaching those made with the magnetron-sputtered ITO electrodes. Researchers also have attempted to produce top electrodes by conductive inks including solutions of conductive polymers, [15][16][17] metal nanowires [18][19][20] or nanoparticles, [21,22] carbon nanotubes, [23] and graphene. [24,25] However, these inks may damage the underneath functional layers due to the organic solvents or the high-temperature sintering step. Therefore, devices with record PCEs still use the silver (Ag) or aluminum (Al) electrodes thermally evaporated in a high degree of vacuum. Such a process is costly, time-consuming, and incompatible with R2R production. The limitations of thermally evaporated top electrodes have become the major obstacle toward fully printed OSCs, and organic-solvent-free top electrode fabricated by printing methods is highly desirable.Requirements for top-electrode materials of OSCs include matching work functions with active materials, high electrical conductivity, printability at moderate temperatures, and low costs. Low-melting-point alloy (LMPA), a class of eutectic alloys with melting points below ≈100 °C, possesses fascinating properties that meet those requirements, making LMPA a promising candidate for vacuum-free electrodes of OSCs. LMPA (including liquid alloys at room temperature) has attracted extensive research interests ranging from stretchable circuitry, strain sensors, and soft robotics, to neural function repairment. [26,27] Recently, LMPAs have also been employed as electrodes in optoelectronic devices, such as quantum-dot lightemitting diodes, [28][29][30] perovskite light-emitting diode, [31] and OSCs. [32][33][34][35][36][37][38][39][40] EGaIn (75% Ga, 25% In) with a melting point of 15.7 °C was pneumatically sprayed as the top electrode of the flexible OSC device with a PCE of 11.2%. [32] By dripping the EGaIn on the functional layers of OSCs, devices with the highest PCE of 14.6% were obtained. [33] However, because EGaIn is molten at room temperature, the unencapsulated devices are vulnerable. LMPAs with a melting point above room temperature were also explored as OSC top electrodes. By using Wood's metal (50% Bi, 25% Pb, 12.5% Sn, 12.5% Cd, melting point 70 °C) as the top electrode, OSC devices based on the P3HT: PCBM reached the highest PCE of 1.8%. [34] An LMPA of The top electrodes of organic solar cells (OSCs) are usually deposited by thermal evaporation in vacuum, which has become the major obstacle toward fully-printed OSCs. The vacuum-free printed top electrodes are highly desirable for the continuous production of OSCs. Here, the printing of lowmelting-point alloy (LMPA) as cathodes in OSCs based on the D18:Y6 system is investigated. The Field's metal (FM) is focused with a melting point of 62 °C, which could be printed under moder...