2009
DOI: 10.1063/1.3183942
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Large-area monocrystalline silicon thin films by annealing of macroporous arrays: Understanding and tackling defects in the material

Abstract: A concept that could provide a thin monocrystalline-silicon absorber layer without resorting to the expensive step of epitaxy would be very appealing for reducing the cost of solar cells. The empty-space-in-silicon technique by which thin films of silicon can be formed by reorganization of regular arrays of cylindrical voids at high temperature may be such a concept if the high quality of the thin film could be ensured on centimeter-large areas. While previous works mainly investigated the influence of the por… Show more

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Cited by 61 publications
(64 citation statements)
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“…Technologies that enable the fabrication of thin c-Si layers in the range of 1 μm [2] up to 40 μm [3,4] directly on glass have been proposed. However, c-Si thin-films of a few micrometers suffer from a significantly reduced optical absorption in the red and nearinfrared regions of the solar spectrum.…”
mentioning
confidence: 99%
“…Technologies that enable the fabrication of thin c-Si layers in the range of 1 μm [2] up to 40 μm [3,4] directly on glass have been proposed. However, c-Si thin-films of a few micrometers suffer from a significantly reduced optical absorption in the red and nearinfrared regions of the solar spectrum.…”
mentioning
confidence: 99%
“…Авторы предшествующих работ [1,[15][16][17][18] считали механизм диф-фузии преимущественно поверхностным.…”
Section: изотермический отжигunclassified
“…Следует отметить, что ни в одном из проведенных нами экспериментов не удавалось достигнуть полного заращивания пор на поверхности, т. е. получить безде-фектную корку, как при отжиге в чистом водороде [1,19]. Дефекты в корке представляют собой отверстия, кото-рые происходят от незакрывшихся пор.…”
Section: изотермический отжигunclassified
See 1 more Smart Citation
“…Some of the most reliable approaches are: (i) cutting thin wafers and thinning them down by chemical mechanical polishing; (ii) growing thin c-Si films by LPCVD on a seed layer; (iii) annealing macroporous arrays formed on a crystalline silicon wafer (also referred to as silicon on nothing [3,4]); and (iv) the "smart cut" [5][6][7] and ion cutting porcesses [8][9][10][11][12].…”
Section: Introductionmentioning
confidence: 99%