2016
DOI: 10.3390/mi7050083
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Large-Scale Integration of All-Glass Valves on a Microfluidic Device

Abstract: In this study, we developed a method for fabricating a microfluidic device with integrated large-scale all-glass valves and constructed an actuator system to control each of the valves on the device. Such a microfluidic device has advantages that allow its use in various fields, including physical, chemical, and biochemical analyses and syntheses. However, it is inefficient and difficult to integrate the large-scale all-glass valves in a microfluidic device using conventional glass fabrication methods, especia… Show more

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Cited by 39 publications
(23 citation statements)
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“…Generally, poly(dimethylsiloxane) (PDMS) is the most commonly used membrane material due to its good optical transparency and high elasticity for large deformations [10]. Other materials, such as thermal plastic polymer [11,12], shape memory alloy [13,14], glass [15], and more are also used in certain situations. As for the deflection of the membrane, various mechanical [16,17], electrostatic [18,19], pneumatic [20,21], magnetic [22,23], piezoelectric [24], or thermal [25] mechanisms have been proposed.…”
Section: Introductionmentioning
confidence: 99%
“…Generally, poly(dimethylsiloxane) (PDMS) is the most commonly used membrane material due to its good optical transparency and high elasticity for large deformations [10]. Other materials, such as thermal plastic polymer [11,12], shape memory alloy [13,14], glass [15], and more are also used in certain situations. As for the deflection of the membrane, various mechanical [16,17], electrostatic [18,19], pneumatic [20,21], magnetic [22,23], piezoelectric [24], or thermal [25] mechanisms have been proposed.…”
Section: Introductionmentioning
confidence: 99%
“…Each glass device had an orifice layer and a microchannel layer. First, we fabricated the microchannel layer using the following lithography method . The channel design was patterned onto a glass photomask by a mask generator (DL‐1000 Nano System Solution, Tokyo, Japan).…”
Section: Methodsmentioning
confidence: 99%
“…S1, Supporting Information) and the fabrication method of the glass device used in this study were the same as in our previous research. 35 The chip had a four-layer-bonded structure. Layer 1 was a layer (0.4 mm in thickness) with channels (150 μm width, 75 μm depth) fabricated by typical wet etching process.…”
Section: Device Fabricationmentioning
confidence: 99%
“…In our previous research, 110 computer-controlled commercial piezoelectric units purchased from KGS Corporation (Saitama, Japan) were used. 35 In this study, we used 11 individual piezoelectric units in the first line. The white pins were piezoelectric units with a diameter of 1 mm, and the pitches of these pins were 4.8 mm (horizontal) and 2.4 mm (vertical).…”
Section: System Structurementioning
confidence: 99%
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