Large Sized Slug on Solid State Lighting Stress and Temperature Analysis

Abstract

High brightness light emitting diodes, LEDs are the latest generation of solid-state lighting devices. These LEDs portray good luminous efficiency and energy saving properties when compared with the conventional lights. Despite the advantages of the LEDs, it is important to dissipate the heat generated by the PN junction of the LED to enviroment as trapped heat in the LED package will degrade the optical performance and life time of the LED. Hence, junction temperature of the LED is an important element which influences the reliability of the LED. The thermal and stress simulation of single chip LED package with 5mm x 5mm x 1mm copper heat slug is presented in this study. Ansys version 11 was utilized for simulation. Input power of 0.1W and 1W was applied to the LED chip. The simulated results exhibited for an input power of 1W, the max junction temperature is 108.71 °C and the stress is 212.41MPa.