Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and F
DOI: 10.1109/iemt.1995.526111
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Laser ablation forward deposition of metal lines for electrical interconnect repair

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Cited by 4 publications
(2 citation statements)
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“…in various specialized applications such as circuit interconnections [7], surface pattering [8], photo mask repair [9], image recordings by transfer of specialized inks [I 0], chip repair technology [11], simultaneous deposition and pattering of high-Tc superconducting films [12], frequency trimming in surface acoustic wave devices [13], and other physical technological aspects [14][15][16][17][18][19]. It is used for fabricating biosensors because it permits to deposit patterns of bio molecules with high spatial resolution [20].…”
Section: Laser Induced Forward Transfer (Lift)mentioning
confidence: 99%
“…in various specialized applications such as circuit interconnections [7], surface pattering [8], photo mask repair [9], image recordings by transfer of specialized inks [I 0], chip repair technology [11], simultaneous deposition and pattering of high-Tc superconducting films [12], frequency trimming in surface acoustic wave devices [13], and other physical technological aspects [14][15][16][17][18][19]. It is used for fabricating biosensors because it permits to deposit patterns of bio molecules with high spatial resolution [20].…”
Section: Laser Induced Forward Transfer (Lift)mentioning
confidence: 99%
“…in various specialized applications such as circuit interconnections [7], surface pattering [8], photo mask repair [9], image recordings by transfer of specialized inks [I 0], chip repair technology [11], simultaneous deposition and pattering of high-Tc superconducting films [12], frequency trimming in surface acoustic wave devices [13], and other physical technological aspects [14][15][16][17][18][19]. It is used for fabricating biosensors because it permits to deposit patterns of bio molecules with high spatial resolution [20].…”
Section: Laser Induced Forward Transfer (Lift)mentioning
confidence: 99%