Modification of glass with ultrashort pulsed (USP) laser radiation with subsequent wet chemical etching is a well-known process, especially for fused silica, and is referred to as selective laser induced etching (SLE). The main advantage of the SLE process is that almost any 3D geometry can be produced, but currently this is mainly limited to the use of fused silica samples with flat surfaces. To extend the SLE process, we have now processed 400 µm thick upward curved borosilicate glass. In the initial studies on planar borosilicate glass, the first process parameters are found and partially transferred to the curved samples. However, it is found that etching of simple structures occurs at different rates when comparing planar and curved material. This presents a challenge for processing curved surfaces, where optical aberrations like spherical aberrations, astigmatism, and coma distort the spot geometry. We are able to spiral cut the curved 400 µm thick borosilicate glass sample as well as drill through it using the SLE process. Difficulties are observed in the structuring of the area with high incident angles at greater radii, since here the influence of optical aberrations becomes dominant. Thus, sufficient modification by the laser radiation is no longer possible. This prevents the subsequent etching process. This allows the limits of the SLE process to be evaluated for thin upward curved borosilicate glass. The spiral created from the curved glass shows high flexibility and therefore the high durability of the material after processing.