Laser-based Adhesion Strength Measurements for Advanced Manufactured Sensor Adhesion Characterization

Khanolkar, Amey; Fujimoto, Kiyo; McMurtrey, Michael D

doi:10.2172/1813576

Cited by 1 publication

(1 citation statement)

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“…In this work at Idaho National Laboratory (INL), a quantifiable laser-based technique called laserinduced spallation [13] was used to provide a quantifiable measure of interfacial strength of AM films printed on metallic substrates. This expands upon prior work where a laser-induced ablation method [14] was used to measure the adhesion strength of printed thin films. The laser-induced spallation method is compared to a standardized pull-off adhesion method since it provides a baseline quantifiable measure of adhesion strength, as observed in Table 2 Sensitive to thickness and mismatch in elastic properties between the substrate and the film/coating; requires the film/coating surface to be smooth to aid in laser interferometry detection.…”

Section: Introductionmentioning

confidence: 70%

Development of Quality Control Methods for Robust and Reliable Sensor Design

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Khanolkar

Fujimoto

et al. 2022

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The successful adoption of additive manufacturing for the rapid prototyping of printed sensors requires the establishment of quantifiable metrics that can interrogate device performance. One measure of performance is the adhesion strength between the substrate and sensor interface, which is critical since the strength of this interface can dictate the accuracy and reliability of the printed sensor. In this work, a non-contact laser-induced spallation technique was used to quantify the adhesion of silver prints on an aluminum alloy substrate. The laserbased method was compared to a standardized pull-off adhesion test, which provided baseline measurements of adhesion strength. The sintering conditions were shown to play an important role in the film-substrate adhesion strength, as well as the cohesion and ductility of the film itself. The methods and results described in this work supports the establishment of process control steps that are necessary for verifying the reliability of printed devices prior to its deployment in critical experiments. vii

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Section: Introductionmentioning

confidence: 70%