2008
DOI: 10.1007/s00339-008-4723-8
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Laser Chemical Processing (LCP)—A versatile tool for microstructuring applications

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Cited by 70 publications
(41 citation statements)
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“…To overcome poor adhesion of plated metal layers on silicon, the ablation of the ARC with a 355 nm ps-laser (compare [11]) is the best option over other processes such as LCP (laser chemical processing, compare [18]), wet chemical ablation, and others ( fig. 7) [4].…”
Section: Baseline Processmentioning
confidence: 99%
“…To overcome poor adhesion of plated metal layers on silicon, the ablation of the ARC with a 355 nm ps-laser (compare [11]) is the best option over other processes such as LCP (laser chemical processing, compare [18]), wet chemical ablation, and others ( fig. 7) [4].…”
Section: Baseline Processmentioning
confidence: 99%
“…Liquid dopant sources can be used as well. In this case the wafer is immersed in organic solutions [22] or Laser Chemical Processing (LCP) can be done [23]. Efficiencies exceeding 20% were achieved by Kray et al [24] using the latter approach, although required the use of microelectronics grade processing such as photolithographically defined Ti/Pd/Ag metal contacts and FZ wafers.…”
Section: Introductionmentioning
confidence: 98%
“…In this process, a selective material removal is based on laser-induced thermochemical reactions between an etchant, for example 5-molar phosphoric acid (H 3 PO 4 ), and a metallic material [8]. It can be applied to all metals with a material specific passivation layer, which protects the workpiece against a chemical dissolution in the acid at room temperature.…”
Section: Introductionmentioning
confidence: 99%