Laser cutting of thick ceramic tile

Fiber Laser Cutting of Alumina Substrates for Electronic Applications Comparison of the Experimentally Determined and Simulated Influence on the Mechanical Strength

“…Therefore, we conclude that the strength reduction by cutting inner contours can be entirely explained by the geometry, i.e., the digitally modulated fiber laser cutting process causes no supplementary strength reduction. Additional damages in laser cut corners as reported, e.g., by Black and Chua [14] are not observed during modulated fiber laser cutting. In turn, these results highlight the superior quality of digital power modulated fiber laser cutting of ceramics for complex contours.…”

“…Black and Chua [14] cut complex contours in 9.2 mm thick alumina with a power modulated 530 W CO 2 laser at 1.5 mm/s and report significant problems with cracks inside and near sharp corners. In addition, inner geometries result in a significant lower strength of the ceramic during fiber laser cutting [15].…”

Laser beam machining—A review

“…Cutting of commercially available ceramic tiles using diamond-saw, hydrodynamic or USM are time consuming and expensive in processing of particular shape. LBM can cut intricate shapes and thick sections in these tiles [40][41][42].…”

“…Laser cutting of thick (1-10 mm) alumina ceramic substrates through controlled fracture using two synchronized laser beams, focused Nd:YAG (for scribing the groove crack) and defocused CO 2 (to induce thermal stresses) show that surface finish obtained at 60 W laser power (for both Nd:YAG and CO 2 ) and 1 mm/s cutting speed was much better than conventional laser cutting [84]. The surface roughness of thick ceramic tiles during CO 2 laser cutting is mainly affected by ratio of power to cutting speed, material composition and thickness, gas type and its pressure [40,41]. Use of nitrogen assist gas and lesser power intensities reduce the surface roughness [74].…”

CO2Laser Processing On Ceramic Substrates Of Light Emitting Diode Assisted By Compressed Gas

“…They discovered that with higher peak power, the diameter of the entrance hole was smaller than that of the exit hole, due to the molten slag and vapor produced by the laser during drilling, which pushed upwards to accumulate on the walls of the hole near the entrance. Using CO 2 lasers and various shield gases, Black and Chua (1997) succeeded in cutting thick ceramic tiles into a variety of shapes. They investigated the cutting surface and found that continuous wave (CW) cutting resulted in higher average roughness than that obtained from pulse mode (PM) and super pulse mode (SPM).…”