1996
DOI: 10.1364/ao.35.007061
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Laser-induced damage studies in silicon and silicon-based photodetectors

Abstract: Laser-induced damage studies have been carried out on single-crystal silicon and silicon-based photodetectors, FND 100 P-I-N photodiodes, and C30954E avalanche photodiodes as a function of repetition frequency for a 1064-nm wavelength. It has been observed that the damage threshold decreases significantly when the samples are irradiated with a large number of pulses. However, this effect is evident only when the repetition frequency is greater than 1 Hz. The results are discussed in light of various existing t… Show more

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Cited by 42 publications
(15 citation statements)
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“…Knowing that the laser-induced damage threshold (LIDT) of silicon for a nanosecond Nd:YAG laser is around 2-5 J∕cm 2 [21][22][23], we see that for all the considered spheres, the fluences on the surface sample are large enough to etch silicon. Due to the material response, the marking features are not the same as the computed full width at half maximum (Γ FWHM ).…”
Section: Photonic Jet Etching On Silicon Wafermentioning
confidence: 99%
“…Knowing that the laser-induced damage threshold (LIDT) of silicon for a nanosecond Nd:YAG laser is around 2-5 J∕cm 2 [21][22][23], we see that for all the considered spheres, the fluences on the surface sample are large enough to etch silicon. Due to the material response, the marking features are not the same as the computed full width at half maximum (Γ FWHM ).…”
Section: Photonic Jet Etching On Silicon Wafermentioning
confidence: 99%
“…Arora and Dawar concluded that thermally‐induced stress and the generation of long‐lived traps are the most probable causes for laser damage in silicon. They formulated an equation to calculate the surface damage threshold energy and they found that this energy is influenced mainly by the pulse duration and the number of laser pulses that are incident on an area 27. Thermally‐induced stress was also found to create cracks at the surface 28.…”
Section: Introductionmentioning
confidence: 99%
“…Thermal stress appears to be one of the most likely causes of laser-induced damage in silicon [8], which can create cracks at the silicon surface [9] and extend defects well into the bulk of the device [10], [11]. One approach to avoid defect generation is to perform the laser doping process prior to dielectric deposition and use an aligned metallisation process [6], [12], which may require the use of linear beam focusing to suppress defect generation [13].…”
Section: Introductionmentioning
confidence: 99%