Laser-induced site-selective silver seeding on polyimide for electroless copper plating

Chen, Dongsheng; Lu, Qinghua; Zhao, Yan

doi:10.1016/j.apsusc.2006.02.039

Cited by 57 publications

(31 citation statements)

References 21 publications

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“…However, the surface activity of polymer substrate is inert, the pretreatment to introduce functional groups and enhance the adhesion to improve the affinity between the catalyst and surface is very important. Several methods such as wet-chemical pretreatment [12], plasma treatment [13], photo-etching by farultraviolet excimer laser radiation [14][15][16], and exposure to flames [17] have been employed to modify the polymer surface. Bicak et al [18] reported that the fabrication of copper coating on polystyrene (PS) sheets by local chlorosulfonation-directed electroless plating.…”

Section: Introductionmentioning

confidence: 99%

Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer

Sun

Huang

Wang³

et al. 2015

J Mater Sci: Mater Electron

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In this work, the electroless nickel plating on poly(ethylene terephthalate) (PET) surface was developed based on printing primer and then immersing in 3-aminopropyltriethoxysilane (KH550) solution. The mechanism of the surface activating and structural properties of nickel plating were investigated using Fourier transform infrared spectroscopy, Hall measurements, optical microscope and T-peel adhesion strength. Results showed the formation of crystalline Ni and Ni-P coatings on the pretreated PET surface. The surface electrical resistivity of nickel coating was reduced from 12.18 to 0.09 ohm cm, and the adhesion strength were 9.74-9.89 N/cm, when the deposited time increased from 1 to 30 min. The average electromagnetic interference-shielding effectiveness of nickel-plated PET sheets maintained a relatively stable value (38.4-37.5 dB) in a frequency range of 0.05-1.5 GHz. The electroless nickel plating was most possibly due to the formation of higher density of carboxyl groups and then graft copolymerization of amine groups onto the pretreated PET surface. Therefore, the pretreated PET surface was more prone to absorb tin sensitizer and palladium catalyst to form an active layer for electroless nickel plating.

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Section: Introductionmentioning

confidence: 99%

Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer

Sun

Huang

Wang³

et al. 2015

J Mater Sci: Mater Electron

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“…Further, several laser machining techniques, such as laserassisted chemical vapor deposition (LCVD), in which deposition is carried out by means of a chemical reaction between the laser beam and a reactive gas; laser ablation machining, in which a solid material is directly processed using laser beams; laser-induced forward transfer (LIFT); and microstereolithography [10][11][12] are being studied because they have applicability to various materials and are relatively simple processes.…”

Section: Introductionmentioning

confidence: 99%

Characteristics of 3D microstructures fabricated using a modified LIFT process

Lee

Moon

2010

Met. Mater. Int.

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A direct writing Laser Induced Forward Transfer (LIFT) process has been applied to various aspects of micromachining processes such as circuit interconnects, microelectronics, and mask repairs. LIFT processing with a polymer coating layer is a promising technique used to deposit micro-size feature and electric circuits. As a laser direct writing technique, the LIFT technique has been applied to micropatterning. However, the geometric accuracy and electrical conductivity of micropatterns fabricated by LIFT are limited. In this study, these difficulties are resolved by depositing 3D conductive microelectrodes on microchannel sidewalls by LIFT, during which process a metal thin film (Cr, Cu) is coated with a polymer (AZ 1512) according to the channel geometry profile. LIFT is carried out under ambient atmospheric conditions. The proposed LIFT technology contributes to the deposition of microelectrodes with geometric accuracy by printing electric circuits with improved electrical conductivity. The surface morphology of the transferred micro-patterns is observed by SEM and an optical surface profiler (Zygo).

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“…6). In addition, low power CW UV directwriting has an important advantage over heat dominated laser writing processes because, in those processes, diffusion of heat can give rise to spreading, irregularity of the final deposit, damage and debris on the substrate [8]. A HeCd laser (λ = 325 nm, P = 3 mW after focus) has demonstrated successful direct-writing.…”

Section: Uv Direct-writingmentioning

confidence: 99%

UV direct-writing of metals on polyimide

Desmulliez²,

McCarthy

et al. 2008

2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

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Conductive micro-patterned copper tracks were fabricated by UV direct-writing of a nanoparticle silver seed layer followed by selective electroless copper deposition. Silver ions were first incorporated into a hydrolyzed polyimide surface layer by wet chemical treatment. A photoreactive polymer coating, methoxy poly(ethylene glycol) (MPEG) was coated on top of the substrate prior to UV irradiation. Electrons released through the interaction between the MPEG molecules and UV photons allowed the reduction of the silver ions across the MPEG/doped polyimide interface. The resultant silver seed layer has a cluster morphology which is suitable for the initiation of electroless plating. Initial results showed that the deposited copper tracks were in good agreement with the track width on the photomask and laser direct-writing can also fabricate smaller line width metal tracks with good accuracy. The facile fabrication presented here can be carried out in air, at atmospheric pressure, and on contoured surfaces.

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Laser-induced site-selective silver seeding on polyimide for electroless copper plating

Cited by 57 publications

References 21 publications

Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer

Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer

Characteristics of 3D microstructures fabricated using a modified LIFT process

UV direct-writing of metals on polyimide

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