2008
DOI: 10.1117/12.759164
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Laser sintering of direct write silver nano-ink conductors for microelectronic applications

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Cited by 15 publications
(9 citation statements)
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“…Some alternative methods for sintering are chemical densification [5], electrical [6], pressure, laser [7][8][9][10] and microwave sintering [11]. It takes a relatively long time to sinter a sheet, typically one to two hours in a convection oven.…”
Section: Introductionmentioning
confidence: 99%
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“…Some alternative methods for sintering are chemical densification [5], electrical [6], pressure, laser [7][8][9][10] and microwave sintering [11]. It takes a relatively long time to sinter a sheet, typically one to two hours in a convection oven.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the wavelength and absorption have an effect on penetration depth. Short pulse duration and selective sintering make it possible to treat only metal areas and produce less heat into the surrounding material [8][9][10]. Short pulse lasers are used typically for micromachining and ablation.…”
Section: Introductionmentioning
confidence: 99%
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“…However, they are higher than Ag NP/G composite electrodes with 2D fillers (1.7 × 10 −7 Ω•m). These composite electrodes reach the same level of resistivity, 1.0 × 10 −7 Ω•m, of Ag NP ink with a silver concentration of 50 wt.% [38].…”
Section: Resultsmentioning
confidence: 84%
“…Due to its computer controlled nature, different designs can be easily made with just a change in programming and no requirement for hard tooling [1][2][3][4][5][6][7][8]. With no single dominant process, it is likely that several will emerge as the process of choice for any single component manufacturing process [10][11][12][13][14][15][16][17].…”
Section: Overview Of Direct Write Technology and The Purpose Of This mentioning
confidence: 99%