LASIE: Large Area Spectroscopic Imaging Ellipsometry for Characterizing Multi-Layered Film Structures

Kim, Dae–Hee; Yun, Young Ho; Joo, Ki-Nam

doi:10.1007/s12541-018-0133-9

Cited by 5 publications

(7 citation statements)

References 14 publications

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“…Ellipsometry fundamentally measures the changes in the state of polarization of light upon reflection from a surface of the specimen. Recently, most research works have been focused on spectroscopic ellipsometry (SE) and its applications because the ellipsometric angles ( Ψ , Δ) in the broad spectral range of the source obtained by SE can produce measurement results that are more reliable and accurate [ 21 , 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 , 31 , 32 ]. However, approaches to improve the measurement accuracy to decouple the film thickness and the refractive index in single-wavelength ellipsometry have been continuously attempted because of its simple cost-effective configurations [ 33 , 34 , 35 ].…”

Section: Technology and Analysis In Optical Film Metrologymentioning

confidence: 99%

“…In case of spectroscopic imaging ellipsometry (SIE), an imaging spectrometer and an area camera are used to obtain the spectroscopic-polarized images. However, previous imaging ellipsometry only focused on the spatial resolution enhancement, and it has moved for measuring the large area of specimen [ 27 , 28 , 29 , 30 , 31 , 32 ].…”

Section: Measurement Schemementioning

confidence: 99%

“… ( A ) Optical configuration of spectroscopic imaging ellipsometry and ( B ) its multi-layered film characterizations originated from Ref. [ 31 ]; BE, a beam expander; P, a polarizer; C R , a rotating compensator; A, an analyzer; S, a specimen; IL, an imaging lens; IS, an imaging spectrometer. …”

Section: Figurementioning

confidence: 99%

“…As the result, the proposed technique enabled to determine simultaneously both thickness and refractive index of ultra-thin films down to 5 nm thickness with the aid of an additional reference measurement [35]. Spectroscopic imaging ellipsometry (SIE) was initially proposed to improve the lateral resolution with the aid of an imaging technique, but SIE has been proposed to obtain the film thickness profiles at the large measurement areas [27][28][29][30][31][32] in recent years. By adopting a low magnification microscope objective with an imaging spectrometer as shown in Figure 2A, a line profile of film thicknesses up to 16.2 mm was obtained by the single operation, and the 3D film thickness profile of the specimen was reconstructed with the lateral scanning of the specimen, as shown in Figure 2B [31].…”

Section: Ellipsometrymentioning

confidence: 99%

“…However, the lateral resolution was determined by the angular resolution limited by the exit pupil of the system, and it was 0.5 mm. [31]; BE, a beam expander; P, a polarizer; C R , a rotating compensator; A, an analyzer; S, a specimen; IL, an imaging lens; IS, an imaging spectrometer.…”

Section: Ellipsometrymentioning

confidence: 99%

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Recent Progress on Optical Tomographic Technology for Measurements and Inspections of Film Structures

Joo

Park

2022

Micromachines

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In this review, we present the recent progress on film metrology focused on the advanced and novel technologies during the last two decades. This review consists of various technologies and their measurement schemes to provide the inspiration for understanding each of the measurement principles and applications. In the technology and analysis section, several optical techniques used in film metrology are introduced and described with their benefits and limitations. The temporal, spatial and snapshot measurement schemes of optical film metrology are introduced in the measurement scheme section, and finally, the prospect on optical film metrology will be provided and discussed with the technology trend.

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Section: Technology and Analysis In Optical Film Metrologymentioning

confidence: 99%

Section: Measurement Schemementioning

confidence: 99%

Section: Figurementioning

confidence: 99%

Section: Ellipsometrymentioning

confidence: 99%

Section: Ellipsometrymentioning

confidence: 99%

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Recent Progress on Optical Tomographic Technology for Measurements and Inspections of Film Structures

Joo

Park

2022

Micromachines

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Multispectral Holographic Intensity and Phase Imaging of Semitransparent Ultrathin Films

Haegele,

Martínez-Cercós,

Arrés Chillón

et al. 2024

ACS Photonics

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In this paper, we demonstrate a novel optical characterization method for ultrathin semitransparent and absorbing materials through multispectral intensity and phase imaging. The method is based on a lateral-shearing interferometric microscopy (LIM) technique, where phase-shifting allows extraction of both the intensity and the phase of transmitted optical fields. To demonstrate the performance in characterizing semitransparent thin films, we fabricated and measured cupric oxide (CuO) seeded gold ultrathin metal films (UTMFs) with mass-equivalent thicknesses from 2 to 27 nm on fused silica substrates. The optical properties were modeled using multilayer thin film interference and a parametric model of their complex refractive indices. The UTMF samples were imaged in the spectral range from 475 to 750 nm using the proposed LIM technique, and the model parameters were fitted to the measured data in order to determine the respective complex refractive indices for varying thicknesses. Overall, by using the combined intensity and phase not only for imaging and quality control but also for determining the material properties, such as complex refractive indices, this technique demonstrates a high potential for the characterization of the optical properties, of (semi-) transparent thin films.

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Spectral and polarization based imaging in deep-ultraviolet excited photoelectron microscopy

Beechem

Smith

Copeland

et al. 2022

Review of Scientific Instruments

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Using photoelectron emission microscopy, nanoscale spectral imaging of atomically thin MoS2 buried between Al2O3 and SiO2 is achieved by monitoring the wavelength and polarization dependence of the photoelectron signal excited by deep-ultraviolet light. Although photons induce the photoemission, images can exhibit resolutions below the photon wavelength as electrons sense the response. To validate this concept, the dependence of photoemission yield on the wavelength and polarization of the exciting light was first measured and then compared to simulations of the optical response quantified with classical optical theory. A close correlation between experiment and theory indicates that photoemission probes the optical interaction of UV-light with the material stack directly. The utility of this probe is then demonstrated when both the spectral and polarization dependence of photoemission observe spatial variation consistent with grains and defects in buried MoS2. Taken together, these new modalities of photoelectron microscopy allow mapping of optical property variation at length scales unobtainable with conventional light-based microscopy.

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LASIE: Large Area Spectroscopic Imaging Ellipsometry for Characterizing Multi-Layered Film Structures

Cited by 5 publications

References 14 publications

Recent Progress on Optical Tomographic Technology for Measurements and Inspections of Film Structures

Recent Progress on Optical Tomographic Technology for Measurements and Inspections of Film Structures

Multispectral Holographic Intensity and Phase Imaging of Semitransparent Ultrathin Films

Spectral and polarization based imaging in deep-ultraviolet excited photoelectron microscopy

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