Proceedings of IEEE Sensors, 2004.
DOI: 10.1109/icsens.2004.1426157
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Lateral p-i-n photodetectors fabricated in a standard commercial GaAs VLSI process

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Cited by 6 publications
(5 citation statements)
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“…Recently, there has been much research for the study and development of high-speed photodetectors [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19]; these devices find their use in many optoelectronic applications such as optical fiber communication systems, chip-to-chip connections, optical heterodyne conversion, and so on [20][21][22][23][24]. The lateral type photodetectors are by far the most advantageous for use in monolithic GaAs optoelectronic integrated circuits (OEIC) [1,[5][6][7][8][9][10][11][12][13][14][15][16][17]. For a long time, the photodetector of choice in such applications has been the lateral metal-semiconductor-metal (MSM).…”
Section: Introductionmentioning
confidence: 99%
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“…Recently, there has been much research for the study and development of high-speed photodetectors [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19]; these devices find their use in many optoelectronic applications such as optical fiber communication systems, chip-to-chip connections, optical heterodyne conversion, and so on [20][21][22][23][24]. The lateral type photodetectors are by far the most advantageous for use in monolithic GaAs optoelectronic integrated circuits (OEIC) [1,[5][6][7][8][9][10][11][12][13][14][15][16][17]. For a long time, the photodetector of choice in such applications has been the lateral metal-semiconductor-metal (MSM).…”
Section: Introductionmentioning
confidence: 99%
“…Although the MSM structures present many advantageous features, such as low dark current, low capacitance per unit area, and easy integrability with metal–semiconductor field effect transistor devices, they suffer, however, from low responsivity. Recently, theoretical studies of the lateral p‐i‐n (LPIN) junctions were conducted to assess their potential to present an alternative to the MSM photodetectors in such OEIC applications . However, the need of the p‐doping to fabricate the LPIN makes it not fully compatible with the GaAs OEIC processing.…”
Section: Introductionmentioning
confidence: 99%
“…The interdigitated lateral pin photodiode (ILPP) structure has been developed on many different substrates utilizing different material as the absorbing layer depending on the respective wavelengths. These include silicon 16, silicon‐on‐SOI (silicon‐on‐insulator) 17, Ge‐on‐SOI 18, GaAs 19 and InGaAs 20–23. The structures developed on InGaAs/InP substrates have exhibited a −3 dB frequency of 2 GHz ( λ = 1.54 µm), 7.5 GHz ( λ = 1.3 µm), 560 MHz ( λ = 1.3 µm) and 100 MHz ( λ = 1.55 µm) respectively.…”
Section: Introductionmentioning
confidence: 99%
“…These include silicon [6], silicon-on-SOI (silicon-on-insulator) [7], Ge-on-SOI [8], GaAs [9] and InGaAs [10 -13]. These include silicon [6], silicon-on-SOI (silicon-on-insulator) [7], Ge-on-SOI [8], GaAs [9] and InGaAs [10 -13].…”
Section: Introductionmentioning
confidence: 99%